Microstructure and sliding wear characterization of Cu/TiB2 copper matrix composites fabricated via friction stir processing

被引:63
作者
Dinaharan, I. [1 ]
Saravanakumar, S. [2 ,3 ]
Kalaiselvan, K. [4 ]
Gopalakrishnan, S. [5 ]
机构
[1] Univ Johannesburg, Dept Mech Engn Sci, Auckland Pk Kingsway Campus, ZA-2006 Johannesburg, South Africa
[2] Angel Coll Engn & Technol, Dept Mech Engn, Tirupur 641665, Tamil Nadu, India
[3] Anna Univ, Dept Mech Engn, Madras 600025, Tamil Nadu, India
[4] Dr NGP Inst Technol, Dept Mech Engn, Coimbatore 641048, Tamil Nadu, India
[5] KS Rangasamy Coll Technol, Dept Mech Engn, Tiruchengode 637215, Tamil Nadu, India
关键词
Copper matrix composites; Friction stir processing; Microstructure; Wear; IN-SITU FORMATION; MECHANICAL-PROPERTIES; SURFACE COMPOSITES; CU-TIB2; COMPOSITES; CONDUCTIVITY; PARTICLES; TIB2; BEHAVIOR;
D O I
10.1016/j.jascer.2017.06.002
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The poor wear performance of copper is improved by reinforcing hard ceramic particles. The present work reports the fabrication of Cu/TiB2 (0, 6, 12, 18 vol.%) copper matrix composites (CMCs) using friction stir processing (FSP). TiB2 particles were initially packed together into a machined groove and were subjected to FSP under a constant set of process parameters. The microstructure was observed using optical, scanning and transmission electron microscopy. The wear behavior was examined using a pin-on-disc apparatus. The micrographs showed a homogeneous distribution of TiB2 particles without aggregation and segregation. The distribution of TiB2 particles was closely persistent across the stir zone. TiB2 particles were well bonded with the copper matrix without any interfacial reaction. Many TiB2 particles fractured during FSP. The grains in the composite were extensively refined because of dynamic recrystallization and pinning effect of TiB2 particles. The wear behavior under dry sliding condition was presented in detail. (C) 2017 The Ceramic Society of Japan and the Korean Ceramic Society. Production and hosting by Elsevier B.V. This is an open access article under the CC BY-NC-ND license.
引用
收藏
页码:295 / 303
页数:9
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