Measurement optimum condition of speckle interferometry based on dual-camera technique

被引：0

作者：

Arai, Y. ^{[1
]}

Takegawa, T. ^{[1
]}

Yokozeki, S. ^{[2
]}

机构：

[1] Kansai Univ, Dept Mech Engn, Osaka 5648680, Japan

[2] Jyouko Appl Opt Lab, Fukuoka 8114142, Japan

来源：

MEASUREMENT | 2011年 / 44卷 / 01期

关键词：

Electronic speckle pattern interferometry; Dynamic measurement; High resolution measurement; Out-of-plane deformation measurement; Deformation of electronic device; FRINGE ANALYSIS METHOD; PATTERN-INTERFEROMETRY; ACCURACY;

D O I：

10.1016/j.measurement.2010.09.006

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The speckle interferometer based on multi-camera technology using two cameras is applied to a dynamic deformation measurement of the package of an electronic device. To perform high precise measurement by this method, the optimum conditions for measurements are discussed concerning the size of speckle and the frequency of carrier signals. Under the optimum conditions, the deformation process of the package during the operation of an operational amplifier is measured. Then, the local maximum deformation can be estimated as 150 nm from experimental results. From the results, it can be also confirmed that electronic devices are deformed by the stress of a heat by an operation every second during the operating time. (C) 2010 Published by Elsevier Ltd.

引用

页码：29 / 33

页数：5

共 25 条

[1] In-plane displacement measurement using electronic-speckle-pattern-interferometry-based on spatial fringe analysis method [J].