SiC MESFETs for high-frequency applications

被引:16
|
作者
Sriram, S [1 ]
Ward, A [1 ]
Henning, J [1 ]
Allen, ST [1 ]
机构
[1] Cree Inc, Durham, NC 27703 USA
关键词
MESFETs; MMICs; reliability; rf power; silicon carbide; trapping;
D O I
10.1557/mrs2005.79
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Significant progress has been made in the development of SiC metal semiconductor field-effect transistors (MESFETs) and monolithic microwave integrated-circuit (MMIC) power amplifiers for high-frequency power applications. Three-inch-diameter high-purity semi-insulating 4H-SiC substrates have been used in this development, enabling high-volume fabrication with improved performance by minimizing surface- and substrate-related trapping issues previously observed in MESFETs. These devices exhibit excellent reliability characteristics, with mean time to failure in excess of 500 In at a junction temperature of 410 degrees C. A sampling of these devices has also been running for over 5000 h in an rf high-temperature operating-life test, with negligible changes in performance. High-power SiC MMIC amplifiers have also been demonstrated with excellent yield and repeatability. These MMIC amplifiers show power performance characteristics not previously available with conventional GaAs technology. These developments have led to the commercial availability of SiC rf power MESFETs and to the release of a foundry process for MMIC fabrication.
引用
收藏
页码:308 / 311
页数:4
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