Sample Preparation for EBSD Analysis: Tips for Metals with Delicate Surfaces

被引:15
作者
Kang, Joo-Hee [1 ]
Kim, Su-Hyeon [1 ]
机构
[1] Korea Inst Mat Sci, Grain Struct Control Grp, Gyeongnam 641831, South Korea
来源
KOREAN JOURNAL OF METALS AND MATERIALS | 2010年 / 48卷 / 08期
关键词
EBSD; metals; microstructure; mechanical polishing; ion-milling; ELECTRON BACKSCATTER DIFFRACTION; AL-SI ALLOYS; ULTRAFINE-GRAINED ALLOY; INTERMETALLIC PHASES; ANNEALING TEXTURE; FILM THICKNESS; COPPER-FILMS; IDENTIFICATION; TEMPERATURE; MICROSTRUCTURE;
D O I
10.3365/KJMM.2010.48.08.730
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Aluminum, magnesium, titanium and high Mn steel are difficult to use in electron backscatter diffraction (EBSD) sample preparation due to the formation of an oxidation layer under conventional polishing. Alcohol-based polishing with colloidal silica suspension was introduced for these delicate samples. A hard particle-embedded sample was analyzed successfully using mechanical polishing. Ion-milling was effective in removing oxidized, deformed and transformed layers after mechanical polishing and was able to reduce artifacts significantly. The microstructure of a cross-section of a thin copper film was evaluated by attachment of a dummy to the film for mechanical polishing.
引用
收藏
页码:730 / 740
页数:11
相关论文
共 28 条
  • [1] [Anonymous], 2009, Electron Backscatter Diffraction in Materials Science, DOI DOI 10.1007/978-0-387-88136-2_1
  • [2] Recrystallization and grain growth of cold-drawn gold bonding wire
    Cho, JH
    Cho, JS
    Moon, JT
    Lee, J
    Cho, YH
    Kim, YW
    Rollett, AD
    Oh, KH
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2003, 34A (05): : 1113 - 1125
  • [3] *EDAX TSL, 2008, OIM AN 5 3 MAN
  • [4] Review - Grain and subgrain characterisation by electron backscatter diffraction
    Humphreys, FJ
    [J]. JOURNAL OF MATERIALS SCIENCE, 2001, 36 (16) : 3833 - 3854
  • [5] HUMPHREYS FJ, 1999, P 12 INT C TEXT MAT, P74
  • [6] Effect of grain size on the uniform ductility of a bulk ultrafine-grained alloy
    Jin, Jae-Eun
    Jung, Yeon-Seung
    Lee, Young-Kook
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 449 : 786 - 789
  • [7] Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film
    Kim, Su-Hyeon
    Kang, Joo-Hee
    Han, Seung Zeon
    [J]. MATERIALS TRANSACTIONS, 2010, 51 (04) : 659 - 663
  • [8] A crystallographic identification of intermetallic phases in Al-Si alloys
    Kral, MV
    [J]. MATERIALS LETTERS, 2005, 59 (18) : 2271 - 2276
  • [9] Identification of intermetallic phases in a eutectic Al-Si casting alloy using electron backscatter diffraction pattern analysis
    Kral, MV
    McIntyre, HR
    Smillie, MJ
    [J]. SCRIPTA MATERIALIA, 2004, 51 (03) : 215 - 219
  • [10] KYEONG JS, 2009, P 2009 FALL C KOR I, P22