Physical and mechanical properties of synthesized low Ag/lead-free Sn-Ag-Cu-xBi (x=0, 1, 2.5, 5 wt%) solders

被引:43
|
作者
Sayyadi, Reza [1 ]
Naffakh-Moosavy, Homam [1 ]
机构
[1] Tarbiat Modares Univ, Dept Mat Engn, Tehran, Iran
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2018年 / 735卷
关键词
SAC and SAC-xBi lead-free solders; Intermetallic compounds; Wettability; Tensile strength; Physical and mechanical properties; LEAD-FREE SOLDER; COATED GRAPHENE NANOSHEETS; TENSILE PROPERTIES; INDIUM ADDITION; BI-SN; ALLOYS; MICROSTRUCTURE; NI; ZN; NANOPARTICLES;
D O I
10.1016/j.msea.2018.08.071
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In order to reduce the price of the SAC357 solder, the percentage of silver was reduced and simultaneously the Bi-element was added to improve the properties of the solder. For this purpose, the bismuth element was added to the base solder Sn-2.5 wt% Ag-0.7 wt% Cu (SAC257) with weight percentages of 1, 2.5 and 5. To evaluate the effects of the addition of bismuth on the physical properties of the new solders, microstructure, XRD, thermal properties, wettability, and density have been investigated. The specimens experienced micro hardness and uniaxial tensile tests. Finally, to evaluate the failure behavior, the fracture surface was studied. The finer microstructure, size reduction of the 13-Sn dendrites, expansion of the eutectic region and formation of small precipitates (about 500 nm in size) in the beta-Sn matrix were among the most important changes in the microstructure of SAC257-xBi solders. Improvement in wettability, no significant changes in density, and reduction in melting point, solidus and liquidus temperatures were other physical changes in the new solders. The mechanical properties of the new SAC257-xBi solders (x = 0, 1, 2.5, 5) such as hardness, yield strength and ultimate tensile strength increased with the addition of bismuth.
引用
收藏
页码:367 / 377
页数:11
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