Recrystallization Behavior of Cu-20Ni-5Sn Alloy

被引：0
|
作者：
Liu, Ruiqing [1 ]
Peng, Lijun [2 ]
Yang, Jiansheng [2 ]
机构：
[1] Jiangxi Univ Technol & Sci, Engn Inst, Ganzhou 34100, Jiangxi, Peoples R China
[2] Jiangxi Univ Sci & Technol, Mat & Chem Engn Fac, Ganzhou 34100, Jiangxi, Peoples R China
来源：
ADVANCED ENGINEERING MATERIALS, PTS 1-3 | 2011年 / 194-196卷
关键词：
Cu-20Ni-5Sn Alloy; Recrystallization Temperature; Microstructure; Grain Growth; Hardness; NI-SN SYSTEM;
D O I：
10.4028/www.scientific.net/AMR.194-196.1352
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Investigate effects of annealing temperature and holding time on the recrystallization temperature, hardness, microstructure and average grain size of Cu-20Ni-5Sn alloy by hardness tester, microscope and XRD. Research the kinetic mechanism of grain growth of recrystallization of Cu-20Ni-5Sn alloy. The research result shows that the recrystallization temperature declines with the increase of cold-deformation. The recrystallization temperature is at about 500 degrees C similar to 650 degrees C respectively for 50% and 60% total cold deformation, and is about 470 degrees C similar to 620 degrees C respectively for 70% and 85% total deformation. The grains grow up with the increase of annealing temperature and holding time.
引用
收藏
页码：1352 / +
页数：2
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