A Floorplanning Algorithm for Novel Three-dimensional Nano Integrated Circuits

被引：0
|
作者：
Luo, Rong [1 ]
Zhang, Xi [1 ]
Shi, Shengqing [1 ]
Sun, Peng [1 ]
机构：
[1] Tsinghua Univ, Dept Elect Engn, Beijing 100084, Peoples R China
来源：
53RD IEEE INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS | 2010年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
A floorplanning algorithm for novel carbon nanotube based three-dimensional integrated circuits is proposed. It is based on ant colony algorithm. The proposed algorithm can optimize the area and area-delay for the single device layer in the three-dimensional integrated circuits, and then optimize the whole 3D IC's area and delay. After the optimization, the performance can improve about 15%.
引用
收藏
页码：857 / 860
页数：4
相关论文
共 50 条
  • [41] Three-dimensional integrated circuits: Performance, design methodology, and CAD tools
    Das, S
    Chandrakasan, A
    Reif, R
    ISVLSI 2003: IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI, PROCEEDINGS: NEW TRENDS AND TECHNOLOGIES FOR VLSI SYSTEMS DESIGN, 2003, : 13 - 18
  • [42] High-model in transmission lines for three-dimensional integrated circuits
    Klyuev, S.B.
    Mezhekova, E.V.
    Nefedov, E.I.
    Popov, R.S.
    Doklady Akademii Nauk, 2002, 383 (05) : 630 - 635
  • [43] Advances and Challenges in Polymer Three-Dimensional Photonic Integrated Circuits (Invited)
    Yin Yuexin
    Zhang Daming
    ACTA OPTICA SINICA, 2024, 44 (15)
  • [44] Three-dimensional imaging of integrated circuits with macro- to nanoscale zoom
    Mirko Holler
    Michal Odstrcil
    Manuel Guizar-Sicairos
    Maxime Lebugle
    Elisabeth Müller
    Simone Finizio
    Gemma Tinti
    Christian David
    Joshua Zusman
    Walter Unglaub
    Oliver Bunk
    Jörg Raabe
    A. F. J. Levi
    Gabriel Aeppli
    Nature Electronics, 2019, 2 : 464 - 470
  • [45] Three-dimensional millimeter-wave photonic integrated circuits on Si
    Minotani, T
    Royter, Y
    Ishii, H
    Hirata, A
    Machida, K
    Sasaki, A
    Nagatsuma, T
    2001 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2001, : 57 - 60
  • [46] Wireless Transceiver for Three-Dimensional Integrated Circuits Using a Ring Oscillator
    Moon, Dongwoo
    Lee, Milim
    Lee, Changhyun
    Park, Joung-Hu
    Park, Changkun
    JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, 2020, 29 (10)
  • [47] Cooling Three-Dimensional Integrated Circuits using Power Delivery Networks
    Wei, Hai
    Wu, Tony F.
    Sekar, Deepak
    Cronquist, Brian
    Pease, Roger Fabian
    Mitra, Subhasish
    2012 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2012,
  • [48] Through-chip microchannels for three-dimensional integrated circuits cooling
    Ao, Lihong
    Ramiere, Aymeric
    THERMAL SCIENCE AND ENGINEERING PROGRESS, 2024, 47
  • [49] Three-dimensional imaging of integrated circuits with macro- to nanoscale zoom
    Holler, Mirko
    Odstrcil, Michal
    Guizar-Sicairos, Manuel
    Lebugle, Maxime
    Mueller, Elisabeth
    Finizio, Simone
    Tinti, Gemma
    David, Christian
    Zusman, Joshua
    Unglaub, Walter
    Bunk, Oliver
    Raabe, Joerg
    Levi, A. F. J.
    Aeppli, Gabriel
    NATURE ELECTRONICS, 2019, 2 (10) : 464 - 470
  • [50] Analysis and optimization of TSV–TSV coupling in three-dimensional integrated circuits
    赵颖博
    董刚
    杨银堂
    Journal of Semiconductors, 2015, 36 (04) : 176 - 183
12345