共 50 条
- [31] Thermal Considerations for Monolithic Integration of Three-Dimensional Integrated Circuits 2013 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2013,
- [32] Special Issue on Testing of Three-Dimensional Stacked Integrated Circuits JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2012, 28 (01): : 1 - 1
- [33] InP-based three-dimensional photonic integrated circuits ADVANCES IN MICROELECTRONIC DEVICE TECHNOLOGY, 2001, 4600 : 10 - 13
- [34] Addressing Aging Issues in Heterogeneous Three-Dimensional Integrated Circuits 2019 IEEE 13TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2019,
- [35] Thermal Via Structural Design in Three-Dimensional Integrated Circuits 2012 13TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2012, : 103 - 108
- [38] A Legalization Algorithm for Multi-Tier Gate-Level Monolithic Three-Dimensional Integrated Circuits PROCEEDINGS OF THE EIGHTEENTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2017, : 277 - 282
- [40] Study on Si-SiGe three-dimensional CMOS integrated circuits Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, 2007, 28 (05): : 681 - 685