Compact Series Power Combining Using Subquarter-Wavelength Baluns in Silicon Germanium at 120 GHz

被引:50
作者
Daneshgar, Saeid [1 ]
Buckwalter, James F. [2 ]
机构
[1] Intel Corp, Intel Labs, Hillsboro, OR 97124 USA
[2] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
关键词
D-band mm-wave power amplifier (PA); series power combining; stacked SiGe heterojunction bipolar transistor (HBT); subquarter-wavelength balun; transmission-line (t-line) transformer; uncompensated Marchand balun; MINIATURIZED MARCHAND BALUN; DBM OUTPUT POWER; WIDE-BAND; CMOS; AMPLIFIER; DESIGN;
D O I
10.1109/TMTT.2018.2867467
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents an explicit analysis of the bandwidth and port imbalance of a subquarter-wave length transmission-line (t-line) transformer and verifies this with the design of a two-stage D-band power amplifier (PA). Series power combining techniques incorporate both stacked heterojunction bipolar transistors (HBTs) and power combining using an 8-way sub-quarter-wavelength t-line transformer above 100 GHz. The extremely compact power combining methodology leads to a small die area of 0.62 mm(2) and a record 254-mW/mm(2) output power per unit die area. The PA has been fabricated in a 90-nm silicon germanium BiCMOS technology and produces more than 21-dBm output power over the frequency range of 114-130 GHz with a peak output power of 160 mW approximate to 22 dBm at 120 GHz and a 3-dB small-signal bandwidth of 35 GHz. This output power is 32% higher than the highest prior art, while the chip area is 77% smaller.
引用
收藏
页码:4844 / 4859
页数:16
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