Compact Series Power Combining Using Subquarter-Wavelength Baluns in Silicon Germanium at 120 GHz

被引:50
作者
Daneshgar, Saeid [1 ]
Buckwalter, James F. [2 ]
机构
[1] Intel Corp, Intel Labs, Hillsboro, OR 97124 USA
[2] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
关键词
D-band mm-wave power amplifier (PA); series power combining; stacked SiGe heterojunction bipolar transistor (HBT); subquarter-wavelength balun; transmission-line (t-line) transformer; uncompensated Marchand balun; MINIATURIZED MARCHAND BALUN; DBM OUTPUT POWER; WIDE-BAND; CMOS; AMPLIFIER; DESIGN;
D O I
10.1109/TMTT.2018.2867467
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents an explicit analysis of the bandwidth and port imbalance of a subquarter-wave length transmission-line (t-line) transformer and verifies this with the design of a two-stage D-band power amplifier (PA). Series power combining techniques incorporate both stacked heterojunction bipolar transistors (HBTs) and power combining using an 8-way sub-quarter-wavelength t-line transformer above 100 GHz. The extremely compact power combining methodology leads to a small die area of 0.62 mm(2) and a record 254-mW/mm(2) output power per unit die area. The PA has been fabricated in a 90-nm silicon germanium BiCMOS technology and produces more than 21-dBm output power over the frequency range of 114-130 GHz with a peak output power of 160 mW approximate to 22 dBm at 120 GHz and a 3-dB small-signal bandwidth of 35 GHz. This output power is 32% higher than the highest prior art, while the chip area is 77% smaller.
引用
收藏
页码:4844 / 4859
页数:16
相关论文
共 60 条
[1]   Multi-Drive Stacked-FET Power Amplifiers at 90 GHz in 45 nm SOI CMOS [J].
Agah, Amir ;
Jayamon, Jefy Alex ;
Asbeck, Peter M. ;
Larson, Lawrence E. ;
Buckwalter, James F. .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2014, 49 (05) :1148-1157
[2]   New Design Formulas for Impedance-Transforming 3-dB Marchand Baluns [J].
Ahn, Hee-Ran ;
Nam, Sangwook .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2011, 59 (11) :2816-2823
[3]   Analysis and design of impedance-transforming planar Marchand baluns [J].
Ang, KS ;
Robertson, ID .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2001, 49 (02) :402-406
[4]  
[Anonymous], 2012, IEEE MTT S INT MICRO
[5]  
[Anonymous], 2012, ANTENNA THEORY DESIG
[6]  
[Anonymous], 2006, 2006 IEEE INT SOLID
[7]  
Badger G., 1980, HAM RADIO 2, V13, P18
[8]  
Ben Yishay R, 2015, IEEE RAD FREQ INTEGR, P391, DOI 10.1109/RFIC.2015.7337787
[9]   Large-Scale Power Combining and Mixed-Signal Linearizing Architectures for Watt-Class mmWave CMOS Power Amplifiers [J].
Bhat, Ritesh ;
Chakrabarti, Anandaroop ;
Krishnaswamy, Harish .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2015, 63 (02) :703-718
[10]   Optimal Design of Broadband Microwave Baluns Using Single-Layer Planar Circuit Technology [J].
Canning, Tim ;
Powell, Jeff R. ;
Cripps, Steve C. .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2014, 62 (05) :1183-1191