共 46 条
[1]
Modeling, simulation, and design methodology of the interconnect and packaging of an ultra-high speed source synchronous bus
[J].
Arabi, T
;
Jones, J
;
Taylor, G
;
Riendeau, D
.
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING,
1998,
:8-11

Arabi, T
论文数: 0 引用数: 0
h-index: 0
机构:
Intel Corp, Component Technol Dev, Hillsboro, OR 97124 USA Intel Corp, Component Technol Dev, Hillsboro, OR 97124 USA

Jones, J
论文数: 0 引用数: 0
h-index: 0
机构:
Intel Corp, Component Technol Dev, Hillsboro, OR 97124 USA Intel Corp, Component Technol Dev, Hillsboro, OR 97124 USA

Taylor, G
论文数: 0 引用数: 0
h-index: 0
机构:
Intel Corp, Component Technol Dev, Hillsboro, OR 97124 USA Intel Corp, Component Technol Dev, Hillsboro, OR 97124 USA

Riendeau, D
论文数: 0 引用数: 0
h-index: 0
机构:
Intel Corp, Component Technol Dev, Hillsboro, OR 97124 USA Intel Corp, Component Technol Dev, Hillsboro, OR 97124 USA
[2]
Rapid Fabrication of Soft, Multilayered Electronics for Wearable Biomonitoring
[J].
Bartlett, Michael D.
;
Markvicka, Eric J.
;
Majidi, Carmel
.
ADVANCED FUNCTIONAL MATERIALS,
2016, 26 (46)
:8496-8504

Bartlett, Michael D.
论文数: 0 引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Mech Engn, Soft Machines Lab, Pittsburgh, PA 15213 USA Carnegie Mellon Univ, Dept Mech Engn, Soft Machines Lab, Pittsburgh, PA 15213 USA

Markvicka, Eric J.
论文数: 0 引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Inst Robot, Soft Machines Lab, Pittsburgh, PA 15213 USA Carnegie Mellon Univ, Dept Mech Engn, Soft Machines Lab, Pittsburgh, PA 15213 USA

Majidi, Carmel
论文数: 0 引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Mech Engn, Soft Machines Lab, Pittsburgh, PA 15213 USA
Carnegie Mellon Univ, Inst Robot, Soft Machines Lab, Pittsburgh, PA 15213 USA Carnegie Mellon Univ, Dept Mech Engn, Soft Machines Lab, Pittsburgh, PA 15213 USA
[3]
A 3D-printed, functionally graded soft robot powered by combustion
[J].
Bartlett, Nicholas W.
;
Tolley, Michael T.
;
Overvelde, Johannes T. B.
;
Weaver, James C.
;
Mosadegh, Bobak
;
Bertoldi, Katia
;
Whitesides, George M.
;
Wood, Robert J.
.
SCIENCE,
2015, 349 (6244)
:161-165

Bartlett, Nicholas W.
论文数: 0 引用数: 0
h-index: 0
机构:
Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA
Harvard Univ, Wyss Inst Biol Inspired Engn, Cambridge, MA 02138 USA Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA

Tolley, Michael T.
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Calif San Diego, Dept Mech & Aerosp Engn, La Jolla, CA 92093 USA Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA

Overvelde, Johannes T. B.
论文数: 0 引用数: 0
h-index: 0
机构:
Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA

Weaver, James C.
论文数: 0 引用数: 0
h-index: 0
机构:
Harvard Univ, Wyss Inst Biol Inspired Engn, Cambridge, MA 02138 USA Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA

Mosadegh, Bobak
论文数: 0 引用数: 0
h-index: 0
机构:
New York Presbyterian Hosp, Dept Radiol, Dalio Inst Cardiovasc Imaging, New York, NY 10021 USA
Weill Cornell Med Coll, New York, NY 10021 USA Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA

Bertoldi, Katia
论文数: 0 引用数: 0
h-index: 0
机构:
Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA

Whitesides, George M.
论文数: 0 引用数: 0
h-index: 0
机构:
Harvard Univ, Wyss Inst Biol Inspired Engn, Cambridge, MA 02138 USA
Harvard Univ, Dept Chem & Chem Biol, Cambridge, MA 02138 USA Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA

Wood, Robert J.
论文数: 0 引用数: 0
h-index: 0
机构:
Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA
Harvard Univ, Wyss Inst Biol Inspired Engn, Cambridge, MA 02138 USA Harvard Univ, Sch Engn & Appl Sci, Cambridge, MA 02138 USA
[4]
A Single Droplet-Printed Double-Side Universal Soft Electronic Platform for Highly Integrated Stretchable Hybrid Electronics
[J].
Byun, Junghwan
;
Oh, Eunho
;
Lee, Byeongmoon
;
Kim, Sangwoo
;
Lee, Seunghwan
;
Hong, Yongtaek
.
ADVANCED FUNCTIONAL MATERIALS,
2017, 27 (36)

Byun, Junghwan
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea

Oh, Eunho
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea

Lee, Byeongmoon
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea

Kim, Sangwoo
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea

Lee, Seunghwan
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea

Hong, Yongtaek
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea Seoul Natl Univ, Dept Elect & Comp Engn, Interuniv Semicond Res Ctr ISRC, Seoul 08826, South Korea
[5]
Fully printable, strain-engineered electronic wrap for customizable soft electronics
[J].
Byun, Junghwan
;
Lee, Byeongmoon
;
Oh, Eunho
;
Kim, Hyunjong
;
Kim, Sangwoo
;
Lee, Seunghwan
;
Hong, Yongtaek
.
SCIENTIFIC REPORTS,
2017, 7

Byun, Junghwan
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea

Lee, Byeongmoon
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea

Oh, Eunho
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea

Kim, Hyunjong
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea

Kim, Sangwoo
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea

Lee, Seunghwan
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea

Hong, Yongtaek
论文数: 0 引用数: 0
h-index: 0
机构:
Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea Seoul Natl Univ, Interuniv Semicond Res Ctr ISRC, Dept Elect & Comp Engn, 1 Gwanak Ro, Seoul 151744, South Korea
[6]
An octopus-bioinspired solution to movement and manipulation for soft robots
[J].
Calisti, M.
;
Giorelli, M.
;
Levy, G.
;
Mazzolai, B.
;
Hochner, B.
;
Laschi, C.
;
Dario, P.
.
BIOINSPIRATION & BIOMIMETICS,
2011, 6 (03)

Calisti, M.
论文数: 0 引用数: 0
h-index: 0
机构:
Scuola Super StAnna, BioRobot Inst, Pisa, Italy Scuola Super StAnna, BioRobot Inst, Pisa, Italy

Giorelli, M.
论文数: 0 引用数: 0
h-index: 0
机构:
Scuola Super StAnna, BioRobot Inst, Pisa, Italy Scuola Super StAnna, BioRobot Inst, Pisa, Italy

Levy, G.
论文数: 0 引用数: 0
h-index: 0
机构:
Hebrew Univ Jerusalem, Jerusalem, Israel Scuola Super StAnna, BioRobot Inst, Pisa, Italy

Mazzolai, B.
论文数: 0 引用数: 0
h-index: 0
机构:
Ist Italiano Tecnol, Ctr MicrobioRobot SSSA, Pontedera, Italy Scuola Super StAnna, BioRobot Inst, Pisa, Italy

Hochner, B.
论文数: 0 引用数: 0
h-index: 0
机构:
Hebrew Univ Jerusalem, Jerusalem, Israel Scuola Super StAnna, BioRobot Inst, Pisa, Italy

Laschi, C.
论文数: 0 引用数: 0
h-index: 0
机构:
Scuola Super StAnna, BioRobot Inst, Pisa, Italy Scuola Super StAnna, BioRobot Inst, Pisa, Italy

Dario, P.
论文数: 0 引用数: 0
h-index: 0
机构:
Scuola Super StAnna, BioRobot Inst, Pisa, Italy
Ist Italiano Tecnol, Ctr MicrobioRobot SSSA, Pontedera, Italy Scuola Super StAnna, BioRobot Inst, Pisa, Italy
[7]
Chortos A, 2016, NAT MATER, V15, P937, DOI 10.1038/NMAT4671
[8]
25th Anniversary Article: The Evolution of Electronic Skin (E-Skin): A Brief History, Design Considerations, and Recent Progress
[J].
Hammock, Mallory L.
;
Chortos, Alex
;
Tee, Benjamin C-K
;
Tok, Jeffrey B-H
;
Bao, Zhenan
.
ADVANCED MATERIALS,
2013, 25 (42)
:5997-6037

Hammock, Mallory L.
论文数: 0 引用数: 0
h-index: 0
机构:
Stanford Univ, Dept Chem Engn, Stanford, CA 94305 USA Stanford Univ, Dept Chem Engn, Stanford, CA 94305 USA

论文数: 引用数:
h-index:
机构:

Tee, Benjamin C-K
论文数: 0 引用数: 0
h-index: 0
机构:
Stanford Univ, Stanford, CA 94305 USA Stanford Univ, Dept Chem Engn, Stanford, CA 94305 USA

Tok, Jeffrey B-H
论文数: 0 引用数: 0
h-index: 0
机构:
Stanford Univ, Dept Chem Engn, Stanford, CA 94305 USA Stanford Univ, Dept Chem Engn, Stanford, CA 94305 USA

Bao, Zhenan
论文数: 0 引用数: 0
h-index: 0
机构:
Stanford Univ, Dept Chem Engn, Stanford, CA 94305 USA Stanford Univ, Dept Chem Engn, Stanford, CA 94305 USA
[9]
A soft robot that navigates its environment through growth
[J].
Hawkes, Elliot W.
;
Blumenschein, Laura H.
;
Greer, Joseph D.
;
Okamura, Allison M.
.
SCIENCE ROBOTICS,
2017, 2 (08)

Hawkes, Elliot W.
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Calif Santa Barbara, Dept Mech Engn, Santa Barbara, CA 93106 USA
Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA Univ Calif Santa Barbara, Dept Mech Engn, Santa Barbara, CA 93106 USA

Blumenschein, Laura H.
论文数: 0 引用数: 0
h-index: 0
机构:
Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA Univ Calif Santa Barbara, Dept Mech Engn, Santa Barbara, CA 93106 USA

Greer, Joseph D.
论文数: 0 引用数: 0
h-index: 0
机构:
Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA Univ Calif Santa Barbara, Dept Mech Engn, Santa Barbara, CA 93106 USA

Okamura, Allison M.
论文数: 0 引用数: 0
h-index: 0
机构:
Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA Univ Calif Santa Barbara, Dept Mech Engn, Santa Barbara, CA 93106 USA
[10]
Self-assembled three dimensional network designs for soft electronics
[J].
Jang, Kyung-In
;
Li, Kan
;
Chung, Ha Uk
;
Xu, Sheng
;
Jung, Han Na
;
Yang, Yiyuan
;
Kwak, Jean Won
;
Jung, Han Hee
;
Song, Juwon
;
Yang, Ce
;
Wang, Ao
;
Liu, Zhuangjian
;
Lee, Jong Yoon
;
Kim, Bong Hoon
;
Kim, Jae-Hwan
;
Lee, Jungyup
;
Yu, Yongjoon
;
Kim, Bum Jun
;
Jang, Hokyung
;
Yu, Ki Jun
;
Kim, Jeonghyun
;
Lee, Jung Woo
;
Jeong, Jae-Woong
;
Song, Young Min
;
Huang, Yonggang
;
Zhang, Yihui
;
Rogers, John A.
.
NATURE COMMUNICATIONS,
2017, 8

Jang, Kyung-In
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA
DGIST, Dept Robot Engn, Daegu 42988, South Korea Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Li, Kan
论文数: 0 引用数: 0
h-index: 0
机构: Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

论文数: 引用数:
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机构:

Xu, Sheng
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Calif San Diego, Dept NanoEngn, La Jolla, CA 92093 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Jung, Han Na
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Yang, Yiyuan
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Kwak, Jean Won
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Jung, Han Hee
论文数: 0 引用数: 0
h-index: 0
机构:
DGIST, Dept Robot Engn, Daegu 42988, South Korea Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Song, Juwon
论文数: 0 引用数: 0
h-index: 0
机构:
DGIST, Dept Robot Engn, Daegu 42988, South Korea Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Yang, Ce
论文数: 0 引用数: 0
h-index: 0
机构:
Tsinghua Univ, AML, Ctr Mech & Mat, Dept Engn Mech, Beijing 100084, Peoples R China Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Wang, Ao
论文数: 0 引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
Tsinghua Univ, AML, Ctr Mech & Mat, Dept Engn Mech, Beijing 100084, Peoples R China Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Liu, Zhuangjian
论文数: 0 引用数: 0
h-index: 0
机构:
Inst High Performance Comp, Singapore 138632, Singapore Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Lee, Jong Yoon
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA
DGIST, Dept Robot Engn, Daegu 42988, South Korea Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Kim, Bong Hoon
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Kim, Jae-Hwan
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Lee, Jungyup
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Yu, Yongjoon
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Kim, Bum Jun
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Jang, Hokyung
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Yu, Ki Jun
论文数: 0 引用数: 0
h-index: 0
机构:
Yonsei Univ, Sch Elect & Elect Engn, Seoul 03722, South Korea Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

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Jeong, Jae-Woong
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Colorado, Dept Elect Comp & Energy Engn, Boulder, CO 80309 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

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Huang, Yonggang
论文数: 0 引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Zhang, Yihui
论文数: 0 引用数: 0
h-index: 0
机构:
Tsinghua Univ, AML, Ctr Mech & Mat, Dept Engn Mech, Beijing 100084, Peoples R China Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

Rogers, John A.
论文数: 0 引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Simpson Querrey Inst BioNanotechnol, Ctr Bio Integrated Elect,McCormick Sch Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Biomed Engn, Simpson Querrey Inst BioNanotechnol, Ctr Bio Integrated Elect,McCormick Sch Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Chem, Simpson Querrey Inst BioNanotechnol, Ctr Bio Integrated Elect,McCormick Sch Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Mech Engn, Simpson Querrey Inst BioNanotechnol, Ctr Bio Integrated Elect,McCormick Sch Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Elect Engn & Comp Sci, Simpson Querrey Inst BioNanotechnol, Ctr Bio Integrated Elect,McCormick Sch Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Neurol Surg, Simpson Querrey Inst BioNanotechnol, Ctr Bio Integrated Elect,McCormick Sch Engn, Evanston, IL 60208 USA
Northwestern Univ, Feinberg Sch Med, Evanston, IL 60208 USA Univ Illinois, Dept Mat Sci & Engn, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA