Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

被引：106

作者：

Siow, K. S. ^{[1
]}

Lin, Y. T. ^{[2
]}

机构：

[1] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelec, Bangi 43600, Selangor, Malaysia

[2] Natl Sun Yat Sen Univ, Coll Management, Dept Business Management, 70 Lianhai Rd, Kaohsiung 804, Taiwan

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2016年 / 138卷 / 02期

关键词：

sintered silver; lead free solders; die-attach materials; nanosilver; DIE-ATTACH; MECHANICAL-PROPERTIES; DEGREES-C; MICROSTRUCTURE; PASTE; BEHAVIOR; JOINTS; NANOPARTICLES; MIGRATION; EVOLUTION;

D O I：

10.1115/1.4033069

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill the operating conditions of wide band-gap (WBG) power device technologies. We review the current technology development of sintered Ag as a bonding material from the perspective of patents filed by various stakeholders since late 1980s. This review addresses the formulation of sintered pastes (i.e., nano-Ag, hybrid Ag, and micron Ag fillers), innovations in the process and equipment to form this Ag joint. This review will provide the insights and confidence to engineers, scientists from universities and industry as well as investors who are developing and commercializing the sintered Ag as a bonding material for microelectronic packaging.

引用

页数：13

共 6 条

[1] Patent Landscape and Market Segments of Sintered Silver as Die Attach Materials in Microelectronic Packaging
Siow, Kim S.
Eugenie, Merigeault
2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE, 2016,
[2] Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
Siow, Kim S.
JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (04) : 947 - 961
[3] Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material
Siow, K. S.
Chua, S. T.
METALS AND MATERIALS INTERNATIONAL, 2020, 26 (09) : 1404 - 1414
[4] Patent Landscape of sintered Cu and Ag as DieAttach Materials in Microelectronics Packaging
Siow, Kim S.
2022 IEEE 39TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2022,
[5] Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
Kim S. Siow
Journal of Electronic Materials, 2014, 43 : 947 - 961
[6] Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material
K. S. Siow
S. T. Chua
Metals and Materials International, 2020, 26 : 1404 - 1414

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