YOUNG'S MODULUS SIZE EFFECT OF SCS NANOBEAM BY TENSILE TESTING IN ELECTRON MICROSCOPY

被引:3
|
作者
Jin, Q. H. [1 ]
Li, T. [1 ]
Wang, Y. L. [1 ]
Li, X. X. [1 ]
Yang, H. [1 ]
Xu, F. F. [2 ]
机构
[1] Chinese Acad Sci, SIMIT, Natl Key Lab Microsyst Technol, State Key Labs Transducer Technol, Shanghai, Peoples R China
[2] Chinese Acad Sci, SIC, Anal & Testing Ctr Inorgan Mat, Shanghai, Peoples R China
关键词
MECHANICAL-PROPERTIES; SILICON; FABRICATION;
D O I
10.1109/ICSENS.2009.5398190
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In-situ tensile testing in EM (electron microscopy) is a useful tool for studying mechanical properties of nano-structures because it can provide quantitative information on sample deformation at atomic scale. In this work, MEMS tensile-testing chips with differently thick < 110 >-oriented SCS nanobeams were designed, fabricated and utilized in SEM and/or TEM to manipulate SCS nanobeam and measure its strain and stress in nano scale. We obtained Young's modulus of SCS nanobeams with thicknesses from 30nm to 100nm, and found that E decreased monotonously with the beams decreasing thickness. A simple modal was constructed to qualitatively illustrate this size dependence by taking surface effect into account and it shows that surface layers have different effects on E in tensile testing from that in resonant testing.
引用
收藏
页码:205 / +
页数:2
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