Thermal analyses of minichannels and use of mathematical and numerical models

Growth in electronic devices comes with a challenge to engineers to provide proficient cooling mechanism in order to evade performance decline. Minichannel heat sinks are one among type of cooling devices to absorb heat formed in the electronic devices. Air is largely employed as cooling fluid in minichannels, but innovative methods are also adopted to enhance the heat transfer during the process. These days with modifications in the fluid flow passage and using liquid coolants such as nanofluids the Nusselt number is enhanced. These structural modifications adopted and different nanofluids employed with various volume concentrations and flow rates passed through minichannels to obtain enhancement in heat transfer rate are compiled in this article. The approach for these investigations is majorly categorized into numerical and experimental works. Numerical studies consisting of wide spread modeling methods like single phase/two phase flow modeling, laminar, transition/turbulent modeling etc. are reviewed. The related in-depth numerical and mathematical models used for computational analyses are detailed out exclusively. Experimental methods consisting of unusual passive techniques such as dimples/protrusions, pin fins, and corrugated channels. to achieve betterment in minichannel thermal performance are also provided. Another prime highlight of this article is compilation (in tabular form) of all the correlations and mathematical models used and developed to analyze different factors/properties during the thermal analyses. This article is concluded by providing an overall idea of different mathematical models and methods adopted in minichannels heat transfer analyses and future aspects to be addressed. Several important areas in minichannels heat transfer analyses exist which demand the optimization of heat and fluid flow processes and the use of machine learning concepts for analysis.