PATENT ISSUES OF EMBEDDED FAN-OUT WAFER/PANEL LEVEL PACKAGING

被引：0
|
作者：
Lau, John H. [1 ]
机构：
[1] ASM Pacific Technol, Hong Kong, Hong Kong, Peoples R China
来源：
2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC) | 2016年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study, the patent issues of embedded fan-out wafer/panel level packaging will be investigated. Emphasis will be placed on the claims of the granted patents and the range of things which might be covered under the patents. Depending on the redistribution-layer line width/spacing, the material, process, equipment, and application of fan-out wafer/panel level packaging are examined and some recommendations are made.
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页数：7
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