Optimization of coupled thermal-structural problems of laminated plates with lamination parameters

The behaviour of a laminated plate with given boundary temperatures and displacement constraints is optimized and the optimization problem is expressed in terms of lamination parameters. Because the thermal conductivity and structural properties of a laminate depend on the lamination parameters of the laminate, the analysis of the plate consists of solving a coupled-field problem. The strain energy, or certain displacements of the laminated plate due to given boundary temperatures and displacement boundary conditions, is optimized with respect to in-plane lamination parameters, and also buckling of the plate is considered. The buckling factors for thermal loading are expressed as a function of four in-plane and four bending lamination parameters, and the smallest factor is maximized with respect to these parameters. In addition to these thermal problems, the natural frequencies of the laminated plate are studied. Since transverse shear deformations are taken into account,the natural frequencies can be expressed as functions of two in-plane and four bending lamination parameters, with respect to which the lowest natural frequency of the plate is maximized. The lay-up for the laminate, corresponding to four optimal in-plane or bending lamination parameters, consists of three layers at most and can be determined using explicit equations. Explicit equations are derived for creating a lay-up having optimal bending lamination parameters.