Study on high-speed deep etching of GaN film by UV laser ablation

High-speed deep etching of GaN thin films by UV (266 nm) laser ablation followed by a treatment in HCl solution, was achieved. The etch rate was as high as 50 nm/pulse. Scanning electron microscopy and scanning probe microscopy measurement results indicate that the surface of the etched films was structurally well-defined and cleanly patterned. Micro-photoluminescence measurements of ablated samples revealed no severe damage to the optical properties or the crystal structure. In addition, coupling with VUV (133-184 nm) laser beams, the etch quality of GaN was markedly improved. The etch rate was 55 nm/pulse (C) 1998 Elsevier Science B.V. All rights reserved.