Electrodeposition current density induced texture and grain boundary engineering in Sn coatings for enhanced corrosion resistance

被引:43
|
作者
Gupta, Abhay [1 ]
Srivastava, Chandan [1 ]
机构
[1] Indian Inst Sci, Dept Mat Engn, Bangalore 560012, Karnataka, India
关键词
Sn; Corrosion; GBCD; Twin boundary; EIS; CHARACTER-DISTRIBUTION; SURFACE ENERGIES; BETA-SN; TIN; NICKEL; SOLDER; ALLOY; BEHAVIOR; STEEL; FILM;
D O I
10.1016/j.corsci.2021.109945
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Sn coatings were electrodeposited over mild steel at different current densities (5 mA cm-2, 20 mA cm-2, 40 mA cm-2, 60 mA cm-2, and 80 mA cm-2). Corrosion resistance was highest for the Sn coating fabricated at 20 mA cm-2, and that it decreased as the current density for electrodeposition increased. Electron backscatter diffraction (EBSD) results revealed that a high fraction of low angle grain boundaries (LAGBs), a high fraction of (031)[013] twin boundaries, a preferred (100) texture, and uniform stress distribution enhanced the corrosion resistance of the 20 mA cm-2 coating while the (110) growth texture deteriorated the corrosion resistance of 80 mA cm- 2 coating.
引用
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页数:14
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