A 32 kb 0.35-1.2 V, 50 MHz-2.5 GHz Bit-Interleaved SRAM With 8 T SRAM Cell and Data Dependent Write Assist in 28-nm UTBB-FDSOI CMOS

被引:12
作者
Grover, Anuj [1 ]
Visweswaran, G. S. [2 ]
Parthasarathy, Chittoor R. [1 ]
Daud, Mohammad [1 ]
Turgis, David [3 ]
Giraud, Bastien [4 ]
Noel, Jean-Philippe [4 ]
Miro-Panades, Ivan [4 ]
Moritz, Guillaume [4 ]
Beigne, Edith [4 ]
Flatresse, Philippe [3 ]
Kumar, Promod [1 ]
Azmi, Shamsi [1 ]
机构
[1] STMicroelectronics, Noida 201308, India
[2] IIIT Delhi, New Delhi 110020, India
[3] STMicroelectronics, F-38920 Crolles, France
[4] CEA LETI, MINATEC, F-38054 Grenoble, France
关键词
Low voltage SRAM; wide voltage range SRAM; voltage scaling; FDSOI; write assist; multiple wordline; bit-interleaved SRAM; MB SRAM; VARIABILITY; TECHNOLOGY; DESIGN; READ;
D O I
10.1109/TCSI.2017.2705116
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An optimized co-design of SRAM cell, assist schemes, and layout is proposed to achieve wide voltage range operation of SRAM from 0.35-1.2 V at all process corners. A differential read asymmetric 8 T memory cell and a data dependent differential supply and body modulation write assist scheme are proposed. We also propose a layout that reduces metal capacitance of wordlines by 54% and also enables bit-interleaving. The proposed assist scheme can be combined with conventional assist schemes to further lower minimum write operational voltage of the SRAM by 70-130 mV at iso-performance without causing reliability concerns. A 32 kb instance is fabricated in 28-nm UTBB-FDSOI technology and efficiency of the proposed scheme is demonstrated with lowest write voltage of 0.32 V. Multiple read assist schemes have been used to simultaneously lower read voltage to 0.35 V. 50 MHz operation is measured when integrated in a DSP processor at 0.358 V. Low voltage and wide voltage range figure of merits are also defined to benchmark the proposed solutions with other works.
引用
收藏
页码:2438 / 2447
页数:10
相关论文
共 27 条
  • [1] Abouzeid Fady, 2013, 2013 Proceedings of the ESSCIRC. 39th European Solid State Circuits Conference (ESSCIRC), P205, DOI 10.1109/ESSCIRC.2013.6649108
  • [2] [Anonymous], 2008, DIGITAL INTEGRATED C
  • [3] A 256-kb 65-nm sub-threshold SRAM design for ultra-low-voltage operation
    Calhoun, Benton Highsmith
    Chandrakasan, Anantha P.
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2007, 42 (03) : 680 - 688
  • [4] Technologies for Ultradynamic Voltage Scaling
    Chandrakasan, Anantha P.
    Daly, Denis C.
    Finchelstein, Daniel Frederic
    Kwong, Joyce
    Ramadass, Yogesh Kumar
    Sinangil, Mahmut Ersin
    Sze, Vivienne
    Verma, Naveen
    [J]. PROCEEDINGS OF THE IEEE, 2010, 98 (02) : 191 - 214
  • [5] An 8T-SRAM for variability tolerance and low-voltage operation in high-performance caches
    Chang, Leland
    Montoye, Robert K.
    Nakamura, Yutaka
    Batson, Kevin A.
    Eickemeyer, Richard J.
    Dennard, Robert H.
    Haensch, Wilfried
    Jamsek, Damir
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2008, 43 (04) : 956 - 963
  • [6] A 16 nm 128 Mb SRAM in High-κ Metal-Gate FinFET Technology With Write-Assist Circuitry for Low-VMIN Applications
    Chen, Yen-Huei
    Chan, Wei-Min
    Wu, Wei-Cheng
    Liao, Hung-Jen
    Pan, Kuo-Hua
    Liaw, Jhon-Jhy
    Chung, Tang-Hsuan
    Li, Quincy
    Lin, Chih-Yung
    Chiang, Mu-Chi
    Wu, Shien-Yang
    Chang, Jonathan
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2015, 50 (01) : 170 - 177
  • [7] Clerc S., 2012, ESSCIRC 2012 - 38th European Solid State Circuits Conference, P313, DOI 10.1109/ESSCIRC.2012.6341317
  • [8] Analysis of Read Current and Write Trip Voltage Variability From a 1-MB SRAM Test Structure
    Fischer, Thomas
    Amirante, Ettore
    Huber, Peter
    Nirschl, Thomas
    Olbrich, Alexander
    Ostermayr, Martin
    Schmitt-Landsiedel, Doris
    [J]. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2008, 21 (04) : 534 - 541
  • [9] Fujiwara H., 2013, PROC VTS, pC118
  • [10] Giridhar B, 2014, ISSCC DIG TECH PAP I, V57, P242, DOI 10.1109/ISSCC.2014.6757418