Thin p/p+ epitaxial layer characterization with the pulsed MOS capacitor

被引:9
|
作者
Lee, SY [1 ]
Schroder, DK
机构
[1] Arizona State Univ, Ctr Solid State Elect Res, Tempe, AZ 85287 USA
[2] Arizona State Univ, Dept Elect Engn, Tempe, AZ 85287 USA
关键词
D O I
10.1016/S0038-1101(98)00194-4
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The defect properties of thin p/p(+) wafer are not as easily characterized as those of bulk wafers. Recombination lifetime and minority carrier diffusion length measurements do not work well for thin layers, but generation lifetime characterization is eminently suitable. However, for thin epitaxial layers it is difficult to determine the correct generation lifetime because the linear portion of the Zerbst plot is too small to extract the generation lifetime when the applied gate voltage confines the space-charge region (scr) to the lightly doped epitaxial layer. For low gate voltages, moreover, the Zerbst slope is higher then that at high gate voltages. A sufficiently high gate voltage extends the scr to the out-diffused p(+) region. However, if the scr reaches the p' region, there is a drop off in the Zerbst plot. We have developed a mathematical analysis for this region. We have also extended the analysis to the measurement of possible p/p(+) interface imperfections, e.g. misfit dislocations. (C) 1998 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:103 / 111
页数:9
相关论文
共 50 条
  • [21] N+ AND P+ SUBSTRATE EFFECTS ON EPITAXIAL SILICON PROPERTIES
    DYSON, W
    ROSSI, JA
    HELLWIG, LG
    MOODY, JW
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1984, 131 (03) : C95 - C95
  • [22] EFFECT OF THIN-FILM STRESS AND OXYGEN PRECIPITATION ON WARPAGE BEHAVIOR OF LARGE DIAMETER CMOS P/P+(100) EPITAXIAL WAFERS
    BEAUCHAINE, D
    WIJARANAKULA, W
    MATLOCK, JH
    MOLLENKOPF, H
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (03) : C112 - C112
  • [23] GENERATION OF MISFIT DISLOCATIONS AND THEIR GETTERING BEHAVIOR IN P/P+ EPITAXIAL WAFERS USED FOR VLSI DEVICES
    KIKUCHI, H
    KITAKATA, M
    TOYOKAWA, F
    MIKAMI, M
    DENKI KAGAKU, 1988, 56 (07): : 521 - 526
  • [24] FORMATION OF SHALLOW P+ LAYER IN SILICON BY PLASMA DOPING
    HARA, T
    NAKAGAWA, S
    SHINADA, K
    NAKAMURA, S
    APPLIED PHYSICS LETTERS, 1993, 63 (01) : 90 - 92
  • [25] Optimization of P+ seeding layer for thin film silicon solar cell by liquid phase epitaxy
    Lee, E
    Lee, K
    Kim, D
    Lee, S
    PROCEEDINGS OF 3RD WORLD CONFERENCE ON PHOTOVOLTAIC ENERGY CONVERSION, VOLS A-C, 2003, : 1214 - 1216
  • [26] CHARACTERIZATION OF SILICIDED SHALLOW N+P JUNCTIONS FORMED BY P+ IMPLANTATION INTO THIN TI FILMS ON SI SUBSTRATES
    JUANG, MH
    CHENG, HC
    SOLID-STATE ELECTRONICS, 1992, 35 (10) : 1535 - 1542
  • [27] Accurate determination of P+ silicon layer thickness for microstructures
    Natl Chiao-Tung Univ, Hsinchu, Taiwan
    J Chin Inst Electr Eng Trans Chin Inst Eng Ser E, 2 (107-111):
  • [28] EFFECTS OF CATHODE LENGTHS AND EPITAXIAL LAYER WIDTHS ON N1+N1-DELTA(P+)N2-N2+P+ AND N1-DELTA(P+)N2P+ SWITCHING DEVICES
    ALBUSTANI, A
    IEE PROCEEDINGS-G CIRCUITS DEVICES AND SYSTEMS, 1990, 137 (06): : 463 - 466
  • [29] Iron solubility in boron-doped silicon and Fe gettering mechanism in p/p+ epitaxial wafers
    Shabani, MB
    Shiina, Y
    Shimanuki, S
    Kirscht, FG
    GETTERING AND DEFECT ENGINEERING IN SEMICONDUCTOR TECHNOLOGY, 2002, 82-84 : 331 - 339
  • [30] Competitive Interaction between Segregation Gettering and Surface Precipitation of Nickel in p/p+ Silicon Epitaxial Wafers
    Torigoe, Kazuhisa
    Ono, Toshiaki
    Nakamura, Kozo
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2015, 4 (09) : Q110 - Q114