Packaging test chip for flip-chip and wire bonding process characterization

被引：0

作者：

Schwizer, J ^{[1
]}

Song, WH ^{[1
]}

Mayer, M ^{[1
]}

Brand, O ^{[1
]}

Baltes, H ^{[1
]}

机构：

[1] ETH, Phys Elect Lab, CH-8093 Zurich, Switzerland

来源：

BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2 | 2003年

关键词：

force sensors; flip-chip; packaging; piezoresistive;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports on the latest member of a test chip family for packaging process characterization, containing a novel flip-chip microsensor that can measure forces in all three directions, acting on each of its solder balls. The large temperature range (40 degreesC to 125 degreesC) places high demand on sensor stability. Various sources for sensor offset and offset drift are identified. Applications include thermal cycling experiments of the flip-chip and detection of physical processes during wire bonding. For Au-Al bond contacts, a quality parameter can be extracted from the sensor signal.

引用

页码：440 / 443

页数：4