Optimal Design of Package Structure of The Hybrid Integrated DC/DC Power Module Based on Orthogonal Experimental Method

被引：0

作者：

Weng Jiancheng ^{[1
,2
,3
]}

He Xiaoqi ^{[2
,3
]}

Liu Ganggang ^{[4
]}

Zhou Bin ^{[2
,3
]}

En Yunfei ^{[2
,3
]}

机构：

[1] Guangdong Univ Technol, Sch Mat & Energy Resources, Guangzhou, Guangdong, Peoples R China

[2] Sci & Technol Reliabil Phys, Guangzhou, Guangdong, Peoples R China

[3] Appl Elect Component Lab, Guangzhou, Guangdong, Peoples R China

[4] GUET, Sch Mech & Elect Engn, Guilin, Peoples R China

来源：

2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2013年

关键词：

DC/DC; power modules; orthogonal experimental method; package; junction temperature;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The hybrid integrated DC/DC power modules are being used in many field, however, the operating temperature of the components becomes higher with the increasing density of the power module assembly. In this paper, orthogonal experimental design method is used to study the variation trend of DC/DC power module package thermal performance with combination of different package structure material and parameters, thus determining primary and secondary order of factor which has an influence on package heat dissipation and obtaining optimum combination of package structure parameters. The results of finite element simulation analysis shows that adopting the optimum combination of package structure parameters can decrease the chip's junction temperature.

引用

页码：409 / +

页数：2

共 5 条

[1]

[Anonymous], 2008, DC DC POW MOD BAS AN

[2]

[Anonymous], HEAT TRANSFER

[3]

Chen Jingbo, 2010, DESIGN DEV IC, V35, P603

[4] Thermal modeling of high frequency DC-DC switching modules: Electromagnetic and thermal simulation of magnetic components [J].

Cova, P. ;

Delmonte, N. ;

Menozzi, R. .

MICROELECTRONICS RELIABILITY, 2008, 48 (8-9) :1468-1472

[5]

Zhang Lei, 2007, SEMICONDUCTOR TECHNO, V32, P933

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