Effect of Temperature on Space Charge Characteristics in Epoxy Resin

被引:47
作者
Liu, Peng [1 ]
Ning, Xin [1 ]
Peng, Zongren [1 ]
Xiang, Zhen [1 ]
Feng, Hua [1 ]
Zhang, Hongliang [1 ]
机构
[1] Xi An Jiao Tong Univ, State Key Lab Elect Insulat & Power Equipment, Xian 710049, Peoples R China
基金
中国国家自然科学基金;
关键词
Bushings; epoxy resin; high-temperature effects; space charge; INSULATION; POLYETHYLENE;
D O I
10.1109/TDEI.2014.004518
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Epoxy resin has been widely used as the dry-type insulation in high voltage direct current bushing. The temperature of the central conductor can go up to 90-105 degrees C. when working at the rated power flow. Thus, the inner insulation made of epoxy resin sustains these high temperatures. In order to study the effect of temperature on the dielectric performance, the space charge characteristics of epoxy resin at different temperatures (21, 40, 60, 80 and 100 degrees C) have been studied with an improved pulsed electro-acoustic set-up. Moreover, the temperature dependence of the volume resistivity has also been measured. Only homocharge close to the electrodes can be found in all tests. The higher the temperature, the more serious the electric field distortion is in the bulk of a sample. The threshold for space charge accumulation decreases remarkably with increasing temperature. Both the apparent trap-controlled charge mobility and the dc conductivity show similar positive temperature dependence, which increases with the elevation of temperature, resulting in different charge decay characteristics at different temperatures. The apparent trap depths corresponding to different temperatures have also been obtained.
引用
收藏
页码:65 / 71
页数:7
相关论文
共 12 条
[11]   Space Charge Behavior in Multi-layer Oil-paper Insulation under Different DC Voltages and Temperatures [J].
Tang, Chao ;
Chen, G. ;
Fu, M. ;
Liao, Rui-jin .
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2010, 17 (03) :775-784
[12]  
Yoshida J., 2009, 2009 IEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2009), P150, DOI 10.1109/CEIDP.2009.5377837