Design considerations for air cooling electronic systems in high altitude conditions

被引:17
作者
Belady, CL
机构
[1] Convex Division, Hewlett-Packard Company, Richardson
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1996年 / 19卷 / 04期
关键词
altitude; temperature; cooling; turbulent; laminar; system impedance;
D O I
10.1109/95.554930
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper will provide an overview of the effects of altitude on electronics cooling, MOL-STD 210 will. be reviewed to demonstrate the relationship of altitude to density as well as to outside air temperature, Once these relationships are understood the paper will discuss the impact of altitude on the performance of air moving devices using the widely accepted fan laws, A discussion of both constant speed and altitude compensating fans will address performance issues such as power dissipation, pressure drop, and free delivery of fans under these conditions, Once the fan performance has been characterized, the system impedance (or pressure drop) must be determined for the appropriate altitude, The paper will cover how system impedance changes under laminar and turbulent flow regimes as altitude varies, The impact of altitude on heat transfer will also be discussed along with the effects of operating in the turbulent and laminar regimes, In order to demonstrate the concepts, an example problem will be worked.
引用
收藏
页码:495 / 500
页数:6
相关论文
共 4 条
[1]  
[Anonymous], 1978, INTRO FLUID MECH
[2]  
[Anonymous], 1983, THERMAL ANAL CONTROL
[3]  
Holman JP., 1992, Heat Transfer
[4]  
1987, MILSTD210C