Electrochemical and microstructural study of Cu-Al-Ni shape memory alloy

被引：54

作者：

Gojic, Mirko ^{[1
]}

Vrsalovic, Ladislav ^{[2
]}

Kozuh, Stjepan ^{[1
]}

Kneissl, Albert ^{[3
]}

Anzel, Ivan ^{[4
]}

Gudic, Senka ^{[2
]}

Kosec, Borut ^{[5
]}

Kliskic, Maja ^{[2
]}

机构：

[1] Univ Zagreb, Fac Met, Sisak 44103, Croatia

[2] Fac Chem & Technol, Dept Electrochem & Mat Protect, Split 2100, Croatia

[3] Univ Leoben, Dept Met Kunde & Werkstoffprufung, A-8700 Leoben, Austria

[4] Univ Maribor, Fac Mech Engn, SLO-2000 Maribor, Slovenia

[5] Univ Ljubljana, Fac Nat Sci & Engn, Ljubljana 1000, Slovenia

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2011年 / 509卷 / 41期

关键词：

Shape memory alloys; Corrosion; Electrochemical impedance spectroscopy; Microstructure; Optical microscopy; Scanning electron microscopy; ALUMINUM-SILVER ALLOYS; CORROSION BEHAVIOR; COPPER-ALUMINUM; INHIBITION; MEDIA; LAYER;

D O I：

10.1016/j.jallcom.2011.07.107

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The corrosive behaviour of Cu-Al-Ni shape memory alloy in deaerated 0.5 M NaCl solution at 20 degrees C was studied by means of open circuit potential measurements, linear polarization, potentiodynamic polarization measurements, cyclic voltammetry and electrochemical impedance spectroscopy measurements. The electrode surface was examined by light microscope, SEM, XRD and EDX methods. The polarization measurements have shown that corrosive behaviour of Cu-Al-Ni alloy in NaCl solution was dominated by the Cu component. The results of impedance measurements at open circuit potential have shown that the overall impedance of the system increases with immersion time due to continuous growth of the passive film on the alloy surface. The XRD and EDX analysis showed the presence of copper, aluminium and nickel compounds, Cu-oxides and Cu-chlorides on alloy surface. (C) 2011 Elsevier B.V. All rights reserved.

引用

页码：9782 / 9790

页数：9

共 38 条

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