Fundamental studies of halogen reactions with III-V semiconductor surfaces

被引:58
作者
Simpson, WC
Yarmoff, JA
机构
[1] UNIV CALIF RIVERSIDE, DEPT PHYS, RIVERSIDE, CA 92521 USA
[2] UNIV CALIF BERKELEY, LAWRENCE BERKELEY LAB, DIV SCI MAT, BERKELEY, CA 94720 USA
关键词
semiconductor processing; gallium arsenide; chlorine; fluorine; etching;
D O I
10.1146/annurev.physchem.47.1.527
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
It is technologically important to understand how halogens react with semiconductor surfaces because halogen compounds are commonly used to etch semiconductor wafers in the microelectronics industry. Halogens are also model adsorbates for studying chemisorption on covalently bonded materials, such as semiconductors, owing to the simple nature of the bonds that they form. The growing use of III-V materials in the manufacture of optoelectronic devices has prompted investigations of the reactions of molecular halogens (XeF2, Cl-2, Br-2, and I-2) with III-V semiconductor surfaces (GaAs, GaSb, InP, InAs, and InSb). This review examines the more fundamental of these investigations, which involve model systems in ultra-high vacuum, focusing on the chemistry of the halogen surface reactions and the physical and electronic structure of the reacted surfaces.
引用
收藏
页码:527 / 554
页数:28
相关论文
共 145 条
[1]   ETCHING OF GAAS FOR PATTERNING BY IRRADIATION WITH AN ELECTRON-BEAM AND CL-2 MOLECULES [J].
AKITA, K ;
TANEYA, M ;
SUGIMOTO, Y ;
HIDAKA, H ;
KATAYAMA, Y .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1989, 7 (06) :1471-1474
[2]   XPS STOICHIOMETRY MEASUREMENTS ON SURFACES OF III-V CRYSTALLINE COMPOUNDS [J].
ALNOT, P ;
OLIVIER, J ;
FADLEY, CS .
JOURNAL OF ELECTRON SPECTROSCOPY AND RELATED PHENOMENA, 1989, 49 (02) :159-173
[3]   MODULATED ION-BEAM STUDIES OF PRODUCT FORMATION AND EJECTION IN ION-INDUCED ETCHING OF GAAS BY CL2 [J].
AMEEN, MS ;
MAYER, TM .
JOURNAL OF APPLIED PHYSICS, 1988, 63 (04) :1152-1157
[4]   SURFACE SEGREGATION DURING REACTIVE ETCHING OF GAAS AND INP [J].
AMEEN, MS ;
MAYER, TM .
JOURNAL OF APPLIED PHYSICS, 1986, 59 (03) :967-969
[5]   DAMAGE AND CONTAMINATION-FREE GAAS AND ALGAAS ETCHING USING A NOVEL ULTRAHIGH-VACUUM REACTIVE ION-BEAM ETCHING SYSTEM WITH ETCHED SURFACE MONITORING AND CLEANING METHOD [J].
ASAKAWA, K ;
SUGATA, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (03) :677-680
[6]  
ASHBY CIH, 1984, APPL PHYS LETT, V45, P892, DOI 10.1063/1.95404
[7]   DOPING LEVEL SELECTIVE PHOTOCHEMICAL DRY ETCHING OF GAAS [J].
ASHBY, CIH .
APPLIED PHYSICS LETTERS, 1985, 46 (08) :752-754
[8]   THE THERMAL AND ION-ASSISTED REACTIONS OF GAAS(100) WITH MOLECULAR CHLORINE [J].
BALOOCH, M ;
OLANDER, DR ;
SIEKHAUS, WJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1986, 4 (04) :794-805
[9]   SURFACE-COMPOSITION AND ETCHING OF III-V SEMICONDUCTORS IN CL-2 ION-BEAMS [J].
BARKER, RA ;
MAYER, TM ;
BURTON, RH .
APPLIED PHYSICS LETTERS, 1982, 40 (07) :583-586
[10]   PREPARATION AND CHARACTERIZATION OF GALLIUM(III) FLUORIDE THIN-FILMS [J].
BARRIERE, AS ;
COUTURIER, G ;
GEVERS, G ;
GUEGAN, H ;
SEGUELOND, T ;
THABTI, A ;
BERTAULT, D .
THIN SOLID FILMS, 1989, 173 (02) :243-252