Wafer-to-wafer bonding for microstructure formation

被引：310

作者：

Schmidt, MA ^{[1
]}

机构：

[1] MIT, Microsyst Technol Labs, Cambridge, MA 02139 USA

来源：

PROCEEDINGS OF THE IEEE | 1998年 / 86卷 / 08期

关键词：

anodic bonding; MEMS; micromachining; silicon direct bonding; silicon fusion bonding; wafer bonding;

D O I：

10.1109/5.704262

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with inter-mediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods are discussed. Opportunities for continued development are outlined.

引用

页码：1575 / 1585

页数：11

共 67 条

[1]

Abe T., 1990, Proceedings of the Fourth International Symposium on Silicon-on-Insulator Technology and Devices, P61

[2]

ABE T, 1993, P 2 INT S SEM WAF BO, V93, P32

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