Microstructure and phase constitution near the interface of Cu/Al vacuum brazing using Al-Si filler metal

被引：100

作者：

Xia, Chunzhi ^{[1
]}

Li, Yajiang ^{[1
,2
]}

Puchkov, U. A. ^{[2
]}

Gerasimov, S. A. ^{[2
]}

Wang, Juan ^{[1
]}

机构：

[1] Shandong Univ, Minist Educ, Key Lab Liquid Struct & Hered Mat, Jinan 250061, Peoples R China

[2] Bauman Moscow State Tech Univ, Dept Mat Sci, Moscow 105005, Russia

来源：

VACUUM | 2008年 / 82卷 / 08期

关键词：

Al/Cu; Al-Si filler metal; vacuum brazing; interface; microstructure;

D O I：

10.1016/j.vacuum.2007.11.007

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Brazing of Cu to Al using Al-Si filler metal has been carried out by vacuum brazing technology. The microstructure and the phase constitution in Cu/Al joint were studied by means of metallography, electron probe microanalyser (EPMA) and X-ray diffraction (XRD). Experimental results obtained showed that two kinds of intermetallic compounds (IMCs) are formed near the interface of copper and brazing seam region and those are Cu3Al2 and CuAl2 phases. Moreover, epsilon-Cu15Si4, Al-Si and CuZn2 are formed on the alpha-Al solid solution in the brazing seam region. Technology parameters of vacuum brazing were: brazing temperature T = 590-610 degrees C, vacuum level 10(-3) Pa, holding time t = 5-10 min. (C) 2007 Elsevier Ltd. All rights reserved.

引用

页码：799 / 804

页数：6