Impact of nanotechnology on wireless communications

被引:0
作者
Li, Er-Ping [1 ]
机构
[1] Inst High Performance Comp, Electromagnet & Nanoelect Res Ctr, Singapore, Singapore
来源
IEEE 2007 INTERNATIONAL SYMPOSIUM ON MICROWAVE, ANTENNA, PROPAGATION AND EMC TECHNOLOGIES FOR WIRELESS COMMUNICATIONS, VOLS I AND II | 2007年
关键词
nanotechnology; wireless communication; multilayer package analysis;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The next-generation high data rate wireless communication systems are expected to offer a completely new ways to access information and services. The need of higher data transfer rate and bandwidth, along with the requirement for low-cost, high efficiency system implementation, has led to an explosion in new technology development for integrated circuit approaches in RF/microwave area, RF receiver& transmitter, data storage and even power supply. A total solution for high system integration of various components is the trend, the 3D system-on-package concept is considered as one of the future solutions. To realize such as complex concept, nanotechnology could play a significant role for continuing innovation in mobile devices, but it faces a lot challenges. This presentation will touch on the concepts of possible impacts of nanotechnology on communication evolution.
引用
收藏
页码:AK31 / AK32
页数:2
相关论文
共 8 条
[1]  
[Anonymous], NANOTECHNOLOGY APPL
[2]  
AVOURIS P, 2002, CHEM PHYS
[3]   Device technologies for RF front-end circuits in next-generation wireless communications [J].
Feng, M ;
Shen, SC ;
Caruth, DC ;
Huang, JJ .
PROCEEDINGS OF THE IEEE, 2004, 92 (02) :354-375
[4]  
LASKAR J, 2001, 2001 INT SURF MOUNT
[5]  
LI EP, 2007, 2007 IEEE INT S EL C
[6]  
*RF AN MIX SIGN TE, 2005, INT TECHN ROADM SEM
[7]   Sensitivity analysis of coupled interconnects for RFIC applications [J].
Shi, Xiaomeng ;
Yeo, Kiat Seng ;
Ma, Jian-Guo ;
Do, Manh Anh ;
Li, Er-Ping .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2006, 48 (04) :607-613
[8]   Gigabit wireless: System-on-a-package technology [J].
Tummala, RR ;
Laskar, J .
PROCEEDINGS OF THE IEEE, 2004, 92 (02) :376-387