On-chip interconnect for mm-wave applications using an all-copper technolgy and wavelength reduction

被引：0
|
作者：
Cheung, TSD [1 ]
Long, JR [1 ]
Vaed, K [1 ]
Volant, R [1 ]
Chinthakindi, A [1 ]
Schnabel, CM [1 ]
Florkey, J [1 ]
Stein, K [1 ]
机构：
[1] Univ Toronto, Toronto, ON, Canada
来源：
2003 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE: DIGEST OF TECHNICAL PAPERS | 2003年 / 46卷
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：396 / +
页数：3
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