Development of Ultrahigh-Voltage SiC Devices

被引:71
作者
Fukuda, Kenji [1 ]
Okamoto, Dai [1 ]
Okamoto, Mitsuo [1 ]
Deguchi, Tadayoshi [1 ]
Mizushima, Tomonori [1 ]
Takenaka, Kensuke [1 ]
Fujisawa, Hiroyuki [1 ]
Harada, Shinsuke [1 ]
Tanaka, Yasunori [1 ]
Yonezawa, Yoshiyuki [1 ]
Kato, Tomohisa [1 ]
Katakami, Shuji [2 ]
Arai, Manabu [2 ]
Takei, Manabu [3 ]
Matsunaga, Shinichiro [3 ]
Takao, Kazuto [4 ]
Shinohe, Takashi [4 ]
Izumi, Toru [5 ]
Hayashi, Toshihiko [5 ]
Ogata, Syuuji [5 ]
Asano, Katsunori [5 ]
Okumura, Hajime [1 ]
Kimoto, Tsunenobu [6 ]
机构
[1] Natl Inst Adv Ind Sci & Technol, Adv Power Elect Res Ctr, Tsukuba, Ibaraki 3058568, Japan
[2] New Japan Radio Co Ltd, Fujimino 3568510, Japan
[3] Fuji Elect Co Ltd, Corp Res & Dev, Tokyo 1918502, Japan
[4] Toshiba Co Ltd, Corp Res & Dev Ctr, Kawasaki, Kanagawa 2128582, Japan
[5] Kansai Elect Power Co Inc, Power Engn Res & Dev Ctr, Amagasaki, Hyogo 6610974, Japan
[6] Kyoto Univ, Dept Elect Sci & Engn, Kyoto 6068501, Japan
基金
日本学术振兴会;
关键词
n-type insulated-gate bipolar transistors (IGBTs); p-i-n; p-type IGBTs; package technology; silicon carbide (SiC); switching test; ultrahigh voltage; 4H-SIC PIN DIODES; HIGH-TEMPERATURE;
D O I
10.1109/TED.2014.2357812
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Ultrahigh-voltage silicon carbide (SiC) devices [p-i-n diodes and insulated-gate bipolar transistors (IGBTs)] and switching test have been investigated. As a result, we have succeeded in developing a 13-kV p-i-n diode, 15-kV p-channel IGBT, and 16-kV flip-type n-channel implantation and epitaxial IGBT with a low differential specific on-resistance (R-diff,R-on). It was revealed that a power module fabricated using a nanotech resin, Si3N4 ceramic substrate, and W base plate was suitable for ultrahigh voltage and high temperature. A switching test was carried out using a clamped inductive load circuit, which indicated that the energy loss of a circuit with ultrahigh-voltage SiC devices is lower than that of Si devices.
引用
收藏
页码:396 / 404
页数:9
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