Microstructure and mechanical strength of transient liquid phase bonded Ti3SiC2 joints using Al interlayer

Based on the structure characteristic of Ti3SiC2 and the easy formation of Ti3Si1-x,AlxC2 Solid solution, a transient liquid phase (TLP) bonding method was used for bonding layered ternary Ti3SiC2 ceramic via Al interlayer. Joining was performed at 1100-1500 degrees C for 120 min under a 5 MPa load in Ar atmosphere. SEM and XRD analyses revealed that Ti3Si(AI)C-2 solid solution rather than intermetallic compounds formed at the interface. The mechanism of bonding is attributed to aluminum diffusing into the Ti-3 SiC2 . The strength of joints was evaluated by three point bending test. The maximum flexural strength reaches a value of 263 +/- 116 MPa, which is about 65% of that of Ti-3 SiC2; for the sample prepared under the joining condition of 1500 degrees C for 120 min under 5 MPa. This flexural strength of the joint is sustained up to 1000 degrees C. (c) 2007 Elsevier Ltd. All rights reserved.