Corrosion Characterization of Sn37Pb Solders and With Cu Substrate Soldering Reaction in 3.5wt.% NaCl Solution

The electrochemical corrosion behavior of Sn37Pb solder, Cu6Sn5, Cu3Sn and Cu in 3.5% NaCl solution was investigated by using Galvanic corrosion testing, potentiodynamic polarization methods. The galvanic current densities for Sn37Pb solder in 3.5wt.% NaCl solution are 38, 16 and 5 mu A/cm(2) for Cu3Sn, Cu, and Cu6Sn5, respectively. Polarization studies revealed that an increase in Cu content and formation of IMCs shifted the corrosion potential (E-corr.) towards more noble values and increased the corrosion current density (I-corr).