Creep of thermally aged SnAgCu-solder joints

被引：0

作者：

Wiese, S ^{[1
]}

Roellig, M ^{[1
]}

Wolter, KJ ^{[1
]}

机构：

[1] Tech Univ Dresden, Elect Packaging Lab, Fak Eul, IAVT, D-01062 Dresden, Germany

来源：

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS | 2005年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The scope of the paper is to present creep data that was obtained from different specimens. It will be shown that the creep behaviour of SnAgCu-solder differs by specimen size and its manufacturing conditions. The paper focuses on the change of creep behaviour as a consequence of thermal aging of the solder. It compares the creep behaviour in the as-cast condition of the alloy with that after thermal storage for 24h, 168h and 1176h at a temperature of 125 degrees C. In addition the paper will point out the effect of different pad metallizations onto creep properties. The paper provides constitutive models for SnAg- and SnAgCu-solders in dependence on the type of pad metallization and aging condition.

引用

页码：79 / 85

页数：7

共 28 条

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