Creep of thermally aged SnAgCu-solder joints

被引：0
|
作者：
Wiese, S [1 ]
Roellig, M [1 ]
Wolter, KJ [1 ]
机构：
[1] Tech Univ Dresden, Elect Packaging Lab, Fak Eul, IAVT, D-01062 Dresden, Germany
来源：
THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS | 2005年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The scope of the paper is to present creep data that was obtained from different specimens. It will be shown that the creep behaviour of SnAgCu-solder differs by specimen size and its manufacturing conditions. The paper focuses on the change of creep behaviour as a consequence of thermal aging of the solder. It compares the creep behaviour in the as-cast condition of the alloy with that after thermal storage for 24h, 168h and 1176h at a temperature of 125 degrees C. In addition the paper will point out the effect of different pad metallizations onto creep properties. The paper provides constitutive models for SnAg- and SnAgCu-solders in dependence on the type of pad metallization and aging condition.
引用
收藏
页码：79 / 85
页数：7
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