Bipolar Mode Operation and Scalability of Double-Gate Capacitorless 1T-DRAM Cells

被引:36
作者
Giusi, Gino [1 ]
Alam, Muhammad Ashraful [2 ]
Crupi, Felice [1 ]
Pierro, Silvio [1 ]
机构
[1] Univ Calabria, Dipartimento Elettron & Informat Sistemist, I-87036 Arcavacata Di Rende, Italy
[2] Purdue Univ, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA
关键词
Band-to-band tunneling (BTBT); capacitorless; 1T-DRAM; device scaling; device simulation; dynamic random access memory (DRAM); impact ionization; DRAM CELL; TECHNOLOGY; INSIGHTS; MEMORY; RAM;
D O I
10.1109/TED.2010.2050104
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we study the operation mode and the scalability of the second generation (type II) of double-gate capacitorless one transistor dynamic random access memory (1T-DRAM) cells. We find that the memory operates by accumulating charge at the gate interfaces, not in the body of the cell. The type-II configuration allows an infinitely long retention of state "1," whereas the total retention time is limited by the leakage associated with state "0" due to band-to-band tunneling (BTBT) at the source/drain to bulk junctions. Extensive and careful scaling analysis shows that longitudinal scaling is limited by short-channel effects related to source/drain to bulk barrier lowering, whereas transverse scaling is limited by BTBT. We conclude that type-II 1T-DRAM is somewhat more scalable than type-I 1T-DRAM (i.e., 15 nm versus 25 nm). The better scaling perspective of type-II 1T-DRAM cells is ascribed to the higher READ sensitivity, programming window, and retention time.
引用
收藏
页码:1743 / 1750
页数:8
相关论文
共 25 条
[1]  
[Anonymous], P ISSCC C
[2]   A capacitorless 1T-DRAM on SOI based on dynamic coupling and double-gate operation [J].
Bawedin, Maryline ;
Cristoloveanu, Sorin ;
Flandre, Denis .
IEEE ELECTRON DEVICE LETTERS, 2008, 29 (07) :795-798
[3]   Scaling limits of double-gate and surround-gate Z-RAM cells [J].
Butt, Nauman Z. ;
Alam, Muhammad Ashraful .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (09) :2255-2262
[4]   SINGLE-TRANSISTOR LATCH IN SOI MOSFETS [J].
CHEN, CED ;
MATLOUBIAN, M ;
SUNDARESAN, R ;
MAO, BY ;
WEI, CC ;
POLLACK, GP .
IEEE ELECTRON DEVICE LETTERS, 1988, 9 (12) :636-638
[5]   A Highly Scalable Capacitorless Double Gate Quantum Well Single Transistor DRAM: 1T-QW DRAM [J].
Ertosun, M. Guenhan ;
Kapur, Pawan ;
Saraswat, Krishna C. .
IEEE ELECTRON DEVICE LETTERS, 2008, 29 (12) :1405-1407
[6]   New insights on "capacitorless" floating-body DRAM cells. [J].
Fossum, Jerry G. ;
Lu, Zhichao ;
Trivedi, Vishal P. .
IEEE ELECTRON DEVICE LETTERS, 2007, 28 (06) :513-516
[7]  
GAUTIER J, 1995, IEDM, P624
[8]   A new capacitorless 1T DRAM cell: Surrounding gate MOSFET with vertical channel (SGVC cell) [J].
Jeong, Hoon ;
Song, Ki-Whan ;
Park, Il Han ;
Kim, Tae-Hun ;
Lee, Yeun Seung ;
Kim, Seong-Goo ;
Seo, Jun ;
Cho, Kyoungyong ;
Lee, Kankyoon ;
Shin, Hyungcheol ;
Lee, Jong Duk ;
Park, Byung-Gook .
IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2007, 6 (03) :352-357
[9]   DRAM technology perspective for gigabit era [J].
Kim, K ;
Hwang, CG ;
Lee, JG .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (03) :598-608
[10]   A capacitorless double-gate DRAM cell [J].
Kuo, C ;
King, TJ ;
Hu, CM .
IEEE ELECTRON DEVICE LETTERS, 2002, 23 (06) :345-347