Real time process monitoring using diffraction-based overlay measurements from YieldStar

被引：4

作者：

Chen, Henry ^{[1
]}

Chang, Jimmy ^{[1
]}

Tsao, Sheng-Tsung ^{[1
]}

Zhang, Junjun ^{[1
]}

Du, Jie ^{[1
]}

Fan, Congcong ^{[1
]}

Huang, Alex ^{[2
]}

Xu, David ^{[2
]}

Liu, Sam ^{[2
]}

Wu, Liang ^{[2
]}

Yang, Kimi ^{[2
]}

Gu, Ning ^{[3
]}

Ren, Liping ^{[3
]}

Wu, Jian ^{[3
]}

Tan, Alexander, II ^{[3
]}

Xia, Sunny ^{[4
]}

Mao, Ivan ^{[4
]}

机构：

[1] ChangXin Memory Technol Inc, Hefei, Anhui, Peoples R China

[2] ASML Brion China Inc, Shenzhen, Guangdong, Peoples R China

[3] ASML Brion US, San Jose, CA USA

[4] ASML China, Shanghai, Peoples R China

来源：

IWAPS 2020: PROCEEDINGS OF 2020 4TH INTERNATIONAL WORKSHOP ON ADVANCED PATTERNING SOLUTIONS (IWAPS) | 2020年

关键词：

process monitoring; diffraction-based overlay; YieldStar; machine learning;

D O I：

10.1109/iwaps51164.2020.9286803

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Real-time process monitoring (RTPM) is a method for semiconductor manufacturing monitoring and tuning using a physical prediction model. It is a fast and non-destructive process excursion measurement method which takes inputs from diffraction-based overlay measurements from YieldStar. The prediction model is created by a physical model which receives standard manufacturing information as input. The prediction capability has been validated in a manufacturing environment experiment with thin film thickness prediction difference less than 3%.

引用

页码：23 / 26

页数：4

共 3 条

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