Interconnect sizing and spacing with consideration of buffer insertion for simultaneous crosstalk-delay optimization

被引:0
作者
Hasani, Fargol [1 ]
Masoumi, Nasser [1 ]
机构
[1] Univ Tehran, Sch ECE, VLSI Res Grp, POB 14395-515, Tehran, Iran
来源
2008 INTERNATIONAL CONFERENCE ON DESIGN & TECHNOLOGY OF INTEGRATED SYSTEMS IN NANOSCALE | 2008年
关键词
nano scale; Interconnect optimization; wire sizing; wire spacing; buffer insertion; optimization algorithm; coupling capacitance; delay; crosstalk;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
As integrated circuits (ICs) are scaled into nanometre dimensions and operate in gigahertz frequencies, interconnects have become critical in determining system performance and reliability. In this paper we propose a new approach to investigate crosstalk reduction techniques which helps to have simultaneous optimization of interconnect delay and crosstalk noise in deep submicron VLSI circuits. The optimization problem is modelled by solving a new cost function to find a minimum cost for both crosstalk noise and delay which are conflicting in nature. Through MATLAB software, a system of three coupled wires is modelled as a RC distributed network. The results indicate the number of optimum available solutions including wire sizing, wire spacing and buffer insertion in which crosstalk reduction techniques can be useful for both crosstalk noise and delay.
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页码:48 / +
页数:2
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