Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

被引：54
作者：
Mookam, Niwat [2 ]
Kanlayasiri, Kannachai [1 ]
机构：
[1] King Mongkuts Inst Technol, Dept Ind Engn, Bangkok 10520, Thailand
[2] Rajamangala Univ Technol Rattanakosin Wang Klai, Dept Ind Engn Technol, Prachuapkhirikhan 77110, Thailand
来源：
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY | 2012年 / 28卷 / 01期
关键词：
Soldering; Intermetallics; Microstructures; Activation energy; MECHANICAL-PROPERTIES; IMC GROWTH; SN; RELIABILITY; MICROSTRUCTURE; INTERFACE; KINETICS; COPPER; BI; NI;
D O I：
10.1016/S1005-0302(12)60023-1
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An eta-Cu6Sn5 intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a Cu3Sn intermetallic phase between the Cu6Sn5 layer and the copper substrate. epsilon-Cu3Sn with an orthorhombic lattice structure was found together with hexagonal Cu3Sn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range.
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收藏
页码：53 / 59
页数：7
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