Effect of high energy ion irradiation on silicon substrate in a pulsed plasma device

被引:13
作者
Bhuyan, H.
Favre, M.
Valderrama, E.
Avaria, G.
Guzman, F.
Chuaqui, H.
Mitchell, I.
Wyndham, E.
Saavedra, R.
Paulraj, M.
机构
[1] Pontificia Univ Catolica Chile, Dept Fis, Santiago 22, Chile
[2] Merchiston Castle Sch, Edinburgh EH13 0PU, Midlothian, Scotland
[3] Univ Concepcion, Dept Fis, Concepcion, Chile
关键词
ion beam irradiation; silicon carbide; plasma focus;
D O I
10.1016/j.apsusc.2007.07.029
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
We have performed an experimental analysis on the investigation of high energy ion beam irradiation on Si(1 0 0) substrates at room temperature using a low energy plasma focus (PF) device operating in methane gas. The surface modifications induced by the ion beams are characterized using standard surface science diagnostic tools, such as X-ray diffraction (XRD), scanning electron microscopy (SEM), photothermal beam deflection, energy-dispersive X-ray (EDX) analysis and atomic force microscope (AFM) and the results are reported. In particular, it has been found that with silicon targets, the application of PF carbon ion beams results in the formation of a surface layer of hexagonal (6H) silicon carbide, with embedded self-organized step/terrace structures. (C) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:197 / 200
页数:4
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