In situ investigation of the fast microstructure evolution during electropulse treatment of cold drawn NiTi wires

被引:74
作者
Malard, B. [1 ,4 ]
Pilch, J. [1 ]
Sittner, P. [1 ]
Delville, R. [2 ]
Curfs, C. [3 ]
机构
[1] Inst Phys, Prague 18221, Czech Republic
[2] Univ Antwerp, EMAT, B-2020 Antwerp, Belgium
[3] European Synchrotron Radiat Facil, F-38043 Grenoble, France
[4] SIMaP, F-38402 St Martin Dheres, France
关键词
Shape memory alloys; Recovery; Recrystallization; Joule heating; Superelasticity; ELECTRIC-CURRENT; PHASE-TRANSFORMATIONS; TI WIRES; ALLOY; NANOCRYSTALLIZATION; AMORPHIZATION;
D O I
10.1016/j.actamat.2010.11.018
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Microstructural changes taking place during the heat treatment of cold-worked NiTi alloy are of key interest in shape memory alloy technology, since they are responsible for setting the austenite shape and functional properties of the heat-treated alloy. In this work, microstructural evolution during non-conventional electropulse heat treatment of thin NiTi filaments was investigated in a unique high-speed in situ synchrotron X-ray diffraction experiment with simultaneous evaluation of the tensile force and electrical resistivity of the treated wire. The in situ results provide direct experimental evidence on the evolution of the internal stress and density of defects during fast heating from 20 degrees C to similar to 700 degrees C. This evidence is used to characterize a sequence of dynamic recovery and recrystallization processes responsible for the microstructure and superelastic functional property changes during the electropulse treatments. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:1542 / 1556
页数:15
相关论文
共 36 条
[1]   Effects of electric current on solid state phase transformations in metals [J].
Conrad, H .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2000, 287 (02) :227-237
[2]   DASH:: a program for crystal structure determination from powder diffraction data [J].
David, William I. F. ;
Shankland, Kenneth ;
van de Streek, Jacco ;
Pidcock, Elna ;
Motherwell, W. D. Samuel ;
Cole, Jason C. .
JOURNAL OF APPLIED CRYSTALLOGRAPHY, 2006, 39 :910-915
[3]   Transmission electron microscopy investigation of dislocation slip during superelastic cycling of Ni-Ti wires [J].
Delville, R. ;
Malard, B. ;
Pilch, J. ;
Sittner, P. ;
Schryvers, D. .
INTERNATIONAL JOURNAL OF PLASTICITY, 2011, 27 (02) :282-297
[4]   Microstructure changes during non-conventional heat treatment of thin Ni-Ti wires by pulsed electric current studied by transmission electron microscopy [J].
Delville, R. ;
Malard, B. ;
Pilch, J. ;
Sittner, P. ;
Schryvers, D. .
ACTA MATERIALIA, 2010, 58 (13) :4503-4515
[5]   Electric current enhanced defect mobility in Ni3Ti intermetallics [J].
Garay, JE ;
Glade, SC ;
Anselmi-Tamburini, U ;
Asoka-Kumar, P ;
Munir, ZA .
APPLIED PHYSICS LETTERS, 2004, 85 (04) :573-575
[6]   Characterization of amorphous and nanocrystalline Ti-Ni-based shape memory alloys [J].
Inaekyan, K. ;
Brailovski, V. ;
Prokoshkin, S. ;
Korotitskiy, A. ;
Glezer, A. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 473 (1-2) :71-78
[7]   Cyclic ageing of Ti-50.8 at.% Ni alloy [J].
Jiang, Fei ;
Li, Li ;
Zheng, Yufeng ;
Yang, Hong ;
Liu, Yinong .
INTERMETALLICS, 2008, 16 (03) :394-398
[8]   Transformation behaviour and unusual twinning in a NiTi shape memory alloy ausformed using equal channel angular extrusion [J].
Karaman, I ;
Kulkarni, AV ;
Luo, ZP .
PHILOSOPHICAL MAGAZINE, 2005, 85 (16) :1729-1745
[9]   Effect of severe ausforming via equal channel angular extrusion on the shape memory response of a NiTi alloy [J].
Kockar, B. ;
Karaman, I. ;
Kulkarni, A. ;
Chumlyakov, Y. ;
Kireeva, I. V. .
JOURNAL OF NUCLEAR MATERIALS, 2007, 361 (2-3) :298-305
[10]   Recrystallization and grain growth in nano-structured austenitic stainless steel under electric current heating [J].
Krawczynska, Agnieszka T. ;
Lewandowska, Malgorzata ;
Kuziak, Roman ;
Kurzydlowski, Krzysztof J. .
PHYSICA STATUS SOLIDI C - CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 7 NO 5, 2010, 7 (05) :1380-1383