Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys

被引：158
|
作者：
Nogita, Kazuhiro [1 ]
Nishimura, Tetsuro [2 ]
机构：
[1] Univ Queensland, Brisbane, QLD 4072, Australia
[2] Nihon Super Co, Suita, Osaka 5640063, Japan
来源：
SCRIPTA MATERIALIA | 2008年 / 59卷 / 02期
关键词：
intermetallic compound; solder; transmission electron microscopy; phase transformation;
D O I：
10.1016/j.scriptamat.2008.03.002
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Cu6Sn5 is an important intermetallic compound (IMC) in lead-free solder alloys. Cu6Sn5 exists in two crystal structures with an allotropic transformation from monoclinic eta'-Cu6Sn5 at temperatures lower than 186 degrees C to hexagonal eta-Cu6Sn5. A detailed analysis by transmission electron microscopy (TEM) in Sn-0.7 wt.% Cu-0.06 wt.% Ni reveals that when the Ni content in (Cu, Ni)(6)Sn-5 is similar to 9 at.% Ni, the hexagonal allotrope of (Cu, Ni)(6)Sn-5 becomes stable at room temperature. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：191 / 194
页数：4
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