Analysis of the Excellent Memory Disturb Characteristics of a Hourglass-Shaped Filament in Al2O3/Cu-Based CBRAM Devices

被引:23
作者
Belmonte, Attilio [1 ,2 ]
Celano, Umberto [1 ,2 ]
Redolfi, Augusto [1 ]
Fantini, Andrea [1 ]
Muller, Robert [1 ]
Vandervorst, Wilfried [1 ,2 ]
Houssa, Michel [1 ,2 ]
Jurczak, Malgorzata
Goux, Ludovic [1 ]
机构
[1] IMEC, B-3001 Louvain, Belgium
[2] Katholieke Univ Leuven, Dept Phys & Astron, B-3000 Louvain, Belgium
关键词
Charge-transfer reaction; conductive-atomic-force microscopy (C-AFM); conductive-bridging; conductive-bridging random access memory (CBRAM); constant voltage stress (CVS); ECM; memory disturb; quantum point contact (QPC); read endurance; voltage-time dilemma; NUCLEATION;
D O I
10.1109/TED.2015.2423094
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
All resistive switching memory devices face a critical voltage-time dilemma, as they require fast write at moderate voltage together with disturb immunity at lower (read) voltage. In this paper, excellent voltage-time characteristics are demonstrated on a 90-nm CMOS-friendly W/Al2O3/TiW/Cu conductive-bridging memory cell. The switching voltage was evaluated in the large write pulsewidth range between 10 ns and 10 s, from which a very low slope of similar to 75 mV/decade was extracted. These characteristics allow, on the one hand, a fast switching (10 ns) at <3 V, and, on the other hand, excellent voltage-disturb immunity extrapolated to +/- 0.5 V for 10 years. Both constant-voltage-stress and read-endurance tests supported these predictions. By means of conductive-atomic-force microscopy tomography, the hourglass shape of the Cu filament was evidenced. Both the more distributed electrical field induced by this shape along the filament and the analysis of a charge-transfer (redox) reaction as rate-limiting mechanism in the switching process are discussed as the origins of this excellent disturb immunity.
引用
收藏
页码:2007 / 2013
页数:7
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