A novel model for undeformed nanometer chips of soft-brittle HgCdTe films induced by ultrafine diamond grits

被引：131
作者：
Zhang, Zhenyu [1 ]
Song, Yaxing [1 ]
Xu, Chaoge [1 ]
Guo, Dongming [1 ]
机构：
[1] Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China
来源：
SCRIPTA MATERIALIA | 2012年 / 67卷 / 02期
基金：
中国国家自然科学基金;
关键词：
Nanometer chip; Ultrafine grit; TEM; HgCdTe; Nanogrinding; MOLECULAR-BEAM EPITAXY; SILICON; NANOINDENTATION; CRYSTALS;
D O I：
10.1016/j.scriptamat.2012.04.017
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Face nanogrinding was conducted on HgCdTe films using a novel ultrafine diamond wheel that we have developed. Damage-free subsurface was achieved after direct face nanogrinding. Two undeformed nanometer chips with rectangular cross-section were observed. The chip thickness varies from 25 to 28 nm, corresponding to a chip width/thickness ratio ranging from 3.2 to 3.4. A novel model of maximum undeformed chip thickness for face grinding was constructed, and the calculated results are consistent with those found experimentally. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：197 / 200
页数：4
相关论文
共 22 条
  • [1] [Anonymous], 2004, MAT SAF DATA SHEET C
  • [2] Comparison of TEM specimen preparation of perovskite thin films by tripod polishing and conventional ion milling
    Eberg, Espen
    Monsen, Asmund F.
    Tybell, Thomas
    van Helvoort, Antonius T. J.
    Holmestad, Randi
    [J]. JOURNAL OF ELECTRON MICROSCOPY, 2008, 57 (06): : 175 - 179
  • [3] FOLL H, 1979, PHILOS MAG A, V40, P497, DOI 10.1080/01418617908234855
  • [4] A new chip-thickness model for performance assessment of silicon carbide grinding
    Gopal, AV
    Rao, PV
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2004, 24 (11-12) : 816 - 820
  • [5] Grinding force and power modeling based on chip thickness analysis
    Hecker, Rogelio L.
    Liang, Steven Y.
    Wu, Xiao Jian
    Xia, Pin
    Jin, David Guo Wei
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2007, 33 (5-6) : 449 - 459
  • [6] Grinding of WC-Co hardmetals
    Hegeman, JBJW
    De Hosson, JTM
    de With, G
    [J]. WEAR, 2001, 248 (1-2) : 187 - 196
  • [7] Evidence for nanoindentation-induced phase transformations in germanium
    Jang, JI
    Lance, MJ
    Wen, SQ
    Pharr, GM
    [J]. APPLIED PHYSICS LETTERS, 2005, 86 (13) : 1 - 3
  • [8] Heat flux distributions and convective heat transfer in deep grinding
    Jin, T.
    Stephenson, D. J.
    [J]. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2006, 46 (14) : 1862 - 1868
  • [9] Malkin S, 2008, GRINDING TECHNOLOGY, P54
  • [10] MALKIN S, 1996, ANN CIRP, V45, P569
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