Case Study on Chip-Package-Board Simulation for Millimeter-wave Integrated Circuit Design Purpose

被引：0
|
作者：
He, Lai [1 ]
Li, Wei [1 ]
机构：
[1] Fudan Univ, State Key Lab ASIC & Syst, Shanghai, Peoples R China
来源：
2019 12TH INTERNATIONAL WORKSHOP ON THE ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS (EMC COMPO 2019) | 2019年
关键词：
millimeter wave; chip-package-PCB; bonding wire; grounding; SMA; connector; pad ring; MARC; LSD; EMC;
D O I：
10.1109/emccompo.2019.8919676
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The division blurs between chip, package and PCB (printed circuit board) in millimeter-wave band, therefore they cannot be cascaded by independent analysis. This paper presents a case study on simultaneous simulation of this kind chip-package-PCB system operating at 24-GHz. Experimental result proves the validity of our simulation methodology that the simulated S21 consists with measurement well with an error about 2-dB (PCB) or in curve tendency (chip-package-PCB). Simplifications of pad ring and transition from connectors to PCB traces are discussed. The validation provides a solid basis for MMIC (millimeter-wave integrated circuit) simulation and advices for MMIC design methodology are proposed in the end.
引用
收藏
页码：275 / 277
页数：3
相关论文
共 50 条
  • [1] A Chip-Package-Board Co-design Methodology
    Lee, Hsu-Chieh
    Chang, Yao-Wen
    2012 49TH ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2012, : 1082 - 1087
  • [2] EMI reduction by chip-package-board co-design
    Kiyoshige, Sho
    Ichimura, Wataru
    Terasaki, Masahiro
    Kobayashi, Ryota
    Sudo, Toshio
    2014 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC EUROPE), 2014, : 946 - 951
  • [3] Co-simulation and Co-design of Chip-Package-Board Interfaces in Highly- Integrated RF Systems
    Issakov, V.
    Wojnowski, M.
    Knapp, H.
    Trotta, S.
    Forstner, H. -P.
    Pressel, K.
    Hagelauer, A.
    2016 IEEE BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING (BCTM), 2016, : 94 - 101
  • [4] AC Power Supply Noise Simulation of CMOS Microprocessor with LSI Chip-Package-Board Integrated Model
    Yoshikawa, Kumpei
    Ichikawa, Kouji
    Nagata, Makoto
    IEICE TRANSACTIONS ON ELECTRONICS, 2014, E97C (04): : 264 - 271
  • [5] Millimeter-wave integrated circuit radiometers
    Weinreb, S
    PASSIVE MILLIMETER-WAVE IMAGING TECHNOLOGY, 1997, 3064 : 80 - 89
  • [6] Design of On-Board Impedance Matching Circuit for Millimeter-Wave Presystem
    Morikoshi, Nobuyuki
    Yokota, Ryo
    Kuramoto, Takafumi
    Uchida, Shinichi
    Tanaka, Tomoyuki
    Ota, Yoshiyuki
    Hiraki, Mitsuru
    Nakamura, Takahiro
    2019 12TH GLOBAL SYMPOSIUM ON MILLIMETER WAVES (GSMM 2019), 2019, : 59 - 61
  • [7] Integrated design and simulation for millimeter-wave antenna systems
    Cwik, T
    Katz, DS
    Villegas, F
    2001 IEEE AEROSPACE CONFERENCE PROCEEDINGS, VOLS 1-7, 2001, : 899 - 907
  • [8] Millimeter-wave integrated circuit design for wireless and radar applications
    Johansen, Tom K.
    Krozer, Viktor
    Vidkjaer, Jens
    Hadziabdic, Dzenan
    Djurhuus, Torsten
    24TH NORCHIP CONFERENCE, PROCEEDINGS, 2006, : 257 - +
  • [9] Chip-package-board co-design for Complex System-on-Chip (SoC)
    Patil, Mahendrasing
    Brahme, Amit
    Shust, Michael
    Coates, Keven
    Thatte, Shubhada
    Soman, Sreekanth
    Kumar, Kamal
    2010 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGE & SYSTEMS SYMPOSIUM, 2010,
  • [10] Millimeter-Wave Propagation within a Computer Chip Package
    Timoneda, Xavier
    Abadal, Sergi
    Cabellos-Aparicio, Albert
    Manessis, Dionysios
    Zhou, Jin
    Franques, Antonio
    Torrellas, Josep
    Alarcon, Eduard
    2018 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2018,
12345