Wafer inspection technology challenges for ULSI manufacturing

被引：0

作者：

Stokowski, S ^{[1
]}

Vaez-Iravani, M ^{[1
]}

机构：

[1] KLA Tencor, Milpitas, CA 95035 USA

来源：

CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY | 1998年 / 449卷

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The use of wafer inspection systems in managing semiconductor manufacturing yields is described. These systems now detect defects of size as small as 40 nm. Some high-speed systems have achieved 200-mm diameter wafer throughputs of 150 wafers per hour. The particular technologies involved are presented. Extensions of these technologies to meet the requirements of manufacturing integrated circuits with smaller structures on larger wafers are discussed.

引用

页码：405 / 415

页数：11