Microcomposite electroforming for LIGA technology

被引：27

作者：

Chou, MC

Yang, H ^{[1
]}

Yeh, SH

机构：

[1] Natl Chung Hsing Univ, Inst Precis Engn, Taichung 402, Taiwan

[2] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu 300, Taiwan

[3] Ind Technol Res Inst, Mat Res Labs, Hsinchu 310, Taiwan

来源：

MICROSYSTEM TECHNOLOGIES | 2001年 / 7卷 / 01期

关键词：

D O I：

10.1007/s005420000063

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Effective methods to improve hardness and thickness uniformity in electroforming for the LIGA process to produce metallic microstructures are described. The result shows the internal stress of Ni-Co alloy deposit can be well tuned between 2 to -2 kg/mm(2) by adding a stress release agent into the electroplating bath. A secondary cathode is applied to improve the thickness uniformity in electroforming without loss plating rate at the center of the features.

引用

页码：36 / 39

页数：4

共 7 条

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