共 95 条
- [4] Process characterization and statistical analysis of oxide CMP on a silicon wafer with sparse data [J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2007, 88 (04): : 785 - 792
- [5] Mathematical modeling of CMP conditioning process [J]. MICROELECTRONIC ENGINEERING, 2007, 84 (04) : 577 - 583
- [6] Anisotropy of chemical mechanical polishing in silicon carbide substrates [J]. MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2007, 142 (01): : 28 - 30
- [7] Chen XF, 2007, J MATER SCI TECHNOL, V23, P430
- [8] Chen XF, 2006, J MATER SCI TECHNOL, V22, P681
- [10] Cheng HB, 2005, MATER MANUF PROCESS, V20, P917, DOI [10.1081/AMP-200060417, 10.1081/AMP-2000604I7]