High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

被引:7
|
作者
Park, Junyong [1 ]
Kim, Hyesoo [1 ]
Kim, Jonghoon J. [1 ]
Kim, Dong-Hyun [1 ]
Son, Kyungjune [1 ]
Kim, Subin [1 ]
Lee, Seongsoo [1 ]
Cho, Kyungjun [1 ]
Bae, Bumhee [3 ]
Ha, Dongho [4 ]
Bae, Michael [4 ]
Kim, Joungho [1 ,2 ]
机构
[1] Korea Adv Inst Sci & Technol, Terahertz Interconnect & Package Lab, Daejeon 305701, South Korea
[2] Samsung Elect, Memory Div, Hwaseong 445701, South Korea
[3] Samsung Elect Co Ltd, Global Technol Ctr, Suwon 16677, South Korea
[4] SRC, Ilsan 10442, South Korea
关键词
Coaxial silicone rubber socket; elastomer-type socket; high-frequency electrical characterization; high-speed channel; package test; test socket; INTERCONNECT;
D O I
10.1109/TCPMT.2018.2828223
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper, for the first time, proposes and verifies a new coaxial silicone rubber socket for high-bandwidth and high-density package test using a fabricated sample. In addition, this paper also characterizes and verifies the coaxial silicone rubber socket. Because of the proposed coaxial socket's novel coaxial structure, the proposed socket successfully achieves the electrical performance improvement. For verification, we compare the proposed socket and the previous noncoaxial socket in time domain. The proposed socket has greater eye height and eye width in the measured eye diagram than those of the noncoaxial socket. Moreover, the slope in the eye diagram is also improved in the case of the proposed socket. Therefore, the measured eye diagram for the coaxial socket shows the improvement in electrical performances. This paper also characterizes the equivalent RLGC model for the coaxial silicone rubber socket. In order to verify the RLGC model, we compare the insertion losses and eye diagrams from measurement, 3-D electromagnetic simulation, and the proposed RLGC model, respectively. Their insertion losses are comparable up to 20 GHz. Furthermore, the obtained eye diagrams are almost identical at the data rate of 9.6 Gb/s. In conclusion, this paper successfully proposes, verifies, and characterizes a new coaxial silicone rubber socket for the first time.
引用
收藏
页码:2152 / 2162
页数:11
相关论文
共 50 条
  • [1] Measurement of High-bandwidth and High-density Silicone Rubber Socket up to 110GHz
    Park, Junyong
    Kim, Hyesoo
    Kim, Jonghoon J.
    Kim, Joungho
    Bae, Bumhee
    Ha, Dongho
    Bae, Michael
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 2481 - 2486
  • [2] Modeling and Measurement of High-bandwidth and High-density Silicone Rubber Socket for 100Gbps Transceiver IC Test
    Park, Junyong
    Kim, Hyesoo
    Kim, Jonghoon J.
    Won, Hyosup
    Bae, Bumhee
    Kim, Joungho
    Bae, Michael
    Ha, Dongho
    2015 IEEE 24TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2015, : 109 - 111
  • [3] High-Frequency Modeling and Signal Integrity Analysis of High-Density Silicone Rubber Socket
    Kim, Hyesoo
    Park, Junyong
    Park, Shinyoung
    Kim, Jonghoon J.
    Kim, Joungho
    Ha, Dongho
    Bae, Michael
    Shin, Jongcheon
    2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM, 2016, : 55 - 57
  • [4] Analysis of External Force Dependent Lumped RLGC Model of High-bandwidth and High-density Silicone Rubber Socket
    Park, Junyong
    Kim, Hyesoo
    Kim, Youngwoo
    Kim, Jonghoon J.
    Bae, Bumhee
    Kim, Joungho
    Ha, Dongho
    Bae, Michael
    2015 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM, 2015, : 54 - 57
  • [5] High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package
    Kim, Hyesoo
    Kim, Jonghoon J.
    Park, Junyong
    Park, Shinyoung
    Choi, Sumin
    Bae, Bumhee
    Ha, DongHo
    Bae, Michael
    Kim, Joungho
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 7 (08): : 1356 - 1368
  • [6] High-frequency electrical performance of a new high-density Multiple Line Grid Array (MLGA) package
    Ahn, S
    Lee, JW
    Kim, J
    Ryu, W
    Kim, YS
    Yoon, CK
    Kim, J
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 497 - 501
  • [7] AC coupled interconnect for high-density high-bandwidth packaging
    Franzon, P
    Mick, S
    Wilson, J
    Luo, L
    Chandrasakhar, K
    MICROELECTRONICS: DESIGN, TECHNOLOGY, AND PACKAGING, 2004, 5274 : 67 - 69
  • [8] HIGH-DENSITY, HIGH-BANDWIDTH CONNECTORS FOR BROAD-BAND ISDN
    NAKANO, K
    YASUDA, K
    KISHIMOTO, T
    IEICE TRANSACTIONS ON ELECTRONICS, 1994, E77C (10) : 1567 - 1574
  • [9] HIGH-VACUUM HIGH-FREQUENCY HIGH-DENSITY E-BEAM TEST FIXTURING
    ARGYRAKIS, SN
    MICROELECTRONIC ENGINEERING, 1992, 16 (1-4) : 447 - 456
  • [10] Ultra high-frequency characterization of high-density 3D module
    Mäntysalo, M
    Tanskanen, J
    Ristolainen, EO
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 242 - 247