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Thermal and electrical properties of silicon nitride substrates
被引:39
|作者:
Dow, H. S.
[1
]
Kim, W. S.
[1
]
Lee, J. W.
[2
]
机构:
[1] Korea Inst Ceram Engn & Technol, Convergence R&D Div, Jinju 52851, South Korea
[2] Pusan Natl Univ, Dept Mat Sci & Engn, Busan 609735, South Korea
来源:
AIP ADVANCES
|
2017年
/
7卷
/
09期
关键词:
MECHANICAL-PROPERTIES;
FRACTURE-TOUGHNESS;
SI3N4;
CERAMICS;
CONDUCTIVITY;
TEMPERATURE;
BETA-SI3N4;
NIOBIUM;
D O I:
10.1063/1.4996314
中图分类号:
TB3 [工程材料学];
学科分类号:
0805 ;
080502 ;
摘要:
This work presents the results of studies on the thermal and electrical properties of sintered silicon nitride to investigate the effects of non-oxide additives. With regard to electrical transport properties, a high electrical resistivity of 10(14) similar to 10(15) Omega cm at 323 K was observed with Si3N4 substrates. Typical electrical resistivity and thermal conductivity values of the Si3N4 substrates were 10(15) Omega cm and 90 W/mK at room temperature, respectively. Based on the results of XPS measurement, it is suggested that the addition of Nb significantly improved oxygen gettering by the phases of Nb2O5. Based on the analysis of the thermal conductivity of Si3N4 substrates, it appears that the interaction between oxygen and Nb in Si3N4, enhanced the thermal conduction rate of Si3N4. (C) 2017 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
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