Digital-pixel Focal Plane Array Development

被引：9

作者：

Brown, Matthew G. ^{[1
]}

Baker, Justin ^{[1
]}

Colonero, Curtis ^{[1
]}

Costa, Joe ^{[1
]}

Gardner, Tom ^{[1
]}

Kelly, Mike ^{[1
]}

Schultz, Ken ^{[1
]}

Tyrrell, Brian ^{[1
]}

Wey, Jim ^{[1
]}

机构：

[1] MIT Lincoln Lab, Lexington, MA 02420 USA

来源：

QUANTUM SENSING AND NANOPHOTONIC DEVICES VII | 2010年 / 7608卷

关键词：

Infrared; Focal Plane Array; ROIC; CMOS; Imaging;

D O I：

10.1117/12.838314

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Since 2006, MIT Lincoln Laboratory has been developing Digital-pixel Focal Plane Array (DFPA) readout integrated circuits (ROICs). To date, four 256 x 256 30 mu m pitch DFPA designs with in-pixel analog to digital conversion have been fabricated using IBM 90 nm CMOS processes. The DFPA ROICs are compatible with a wide range of detector materials and cutoff wavelengths; HgCdTe, QWIP, and InGaAs photo-detectors with cutoff wavelengths ranging from 1.6 to 14.5 mu m have been hybridized to the same digital-pixel readout. The digital-pixel readout architecture offers high dynamic range, A/C or D/C coupled integration, and on-chip image processing with low power orthogonal transfer operations. The newest ROIC designs support two-color operation with a single Indium bump connection. Development and characterization of the two-color DFPA designs is presented along with applications for this new digital readout technology.

引用

页数：10